Roles of additives in damascene copper electropolishing

Journal of the Electrochemical Society

Volumn 153, Issue 6, 2006, Pages

  Liu, Sue Hong ^a   Shieh, Jia Min ^b   Chen, Chih ^a   Hensen, Karl ^c   Cheng, Shih Song ^c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^c Merck Electronic Chemicals Limited   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLYTES; ELECTROLYTIC POLISHING; ESTERIFICATION; ORGANIC ACIDS; REACTION KINETICS;

COPPER ELECTROPOLISHING; ELECTROPOLISHING ELECTROLYTES; VISCOUS LAYER;

ADDITIVES;

EID: 33646390948     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2193348     Document Type: Article

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