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Volumn 1, Issue , 2006, Pages 152-160

Characterization of mechanical properties of eutectic Sn-Co-Cu lead free alloy

Author keywords

[No Author keywords available]

Indexed keywords

PHASE COMPOSITION; PROBLEM SOLVING; SOLDERING ALLOYS; STRAIN RATE; TENSILE STRENGTH;

EID: 42549152805     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.279993     Document Type: Conference Paper
Times cited : (7)

References (16)
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    • Pang, J.H.L., Xiong, B.S., and Low, T.H., "Low cycle fatigue studey of lead free 99.3Sn-0.7Cu solder alloy," International Journal of Fatigue, Vol.26 (2004) pp.865-872.
    • (2004) International Journal of Fatigue , vol.26 , pp. 865-872
    • Pang, J.H.L.1    Xiong, B.S.2    Low, T.H.3
  • 3
    • 1642324965 scopus 로고    scopus 로고
    • Properties of lead-free solder alloys with rare earth elements additions
    • Wu, C.M.L., Yu, D.Q., Law, C.M.T., and Wang, L., "Properties of lead-free solder alloys with rare earth elements additions," Materials Science and Engineering, R 44 (2004) pp. 1-44.
    • (2004) Materials Science and Engineering, R , vol.44 , pp. 1-44
    • Wu, C.M.L.1    Yu, D.Q.2    Law, C.M.T.3    Wang, L.4
  • 5
    • 0032649115 scopus 로고    scopus 로고
    • Effects of strain rate and temperature on the stress-strain tresponse of solder alloys
    • W.J.Plumbridge and C.R. Gagg, "Effects of strain rate and temperature on the stress-strain tresponse of solder alloys," Journal of Materials Science: Materials in Electronics, 10, (1999), pp. 461-468.
    • (1999) Journal of Materials Science: Materials in Electronics , vol.10 , pp. 461-468
    • Plumbridge, W.J.1    Gagg, C.R.2
  • 6
    • 0346216053 scopus 로고    scopus 로고
    • Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity
    • S. Ikuo, Y. Tomohiro., T. Takehiko and H. Susumu "Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity," Materials Science and Engineering, A366, (2004) pp: 50-55.
    • (2004) Materials Science and Engineering , vol.A366 , pp. 50-55
    • Ikuo, S.1    Tomohiro, Y.2    Takehiko, T.3    Susumu, H.4
  • 7
    • 4944248520 scopus 로고    scopus 로고
    • Thermodynamic assessment of Sn-Co lead-free solder system
    • L. Liu, C. Andersson, and J. Liu, "Thermodynamic assessment of Sn-Co lead-free solder system," Journal of Electronic Materials, v 33, n 9, ( 2004), p 935-939.
    • (2004) Journal of Electronic Materials , vol.33 , Issue.9 , pp. 935-939
    • Liu, L.1    Andersson, C.2    Liu, J.3
  • 8
    • 42549116966 scopus 로고    scopus 로고
    • http://www.metalprices.com/FreeSite/metals/ag/ag.asp
  • 9
    • 42549153143 scopus 로고    scopus 로고
    • Zugproben
    • DIN 50 125, ISO 6892-1984
    • Zugproben, DIN 50 125, ISO 6892-1984
  • 10
    • 42549123941 scopus 로고    scopus 로고
    • Standard methods of tension testing of metallic foil, E345-93, Annual Book of ASTM standards, 03.01, 1993.
    • Standard methods of tension testing of metallic foil, E345-93, Annual Book of ASTM standards, Vol. 03.01, 1993.
  • 11
    • 42549163115 scopus 로고    scopus 로고
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  • 12
    • 0037302714 scopus 로고    scopus 로고
    • K.S. Kim et al, effect of fourth ...] K.S. Kim, S.H. Hug and K. Suganuma, Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu, Microelectronics Reliability, 43,( 2003), pp: 259-267.
    • K.S. Kim et al, "effect of fourth ...] K.S. Kim, S.H. Hug and K. Suganuma, "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu," Microelectronics Reliability, 43,( 2003), pp: 259-267.
  • 13
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    • The effect of strain rate and temperature on the tensile properties of Sn-3.5Ag solder
    • F. Lang, H. Tanaka, O. Munegata, T. Taguchi and T. Narita, "The effect of strain rate and temperature on the tensile properties of Sn-3.5Ag solder," Materials characterization, 54, (2005) pp. 223-229.
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  • 14
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    • Jr.,W.D. Callister., Materials Science and Engineering- and introduction, John Willey & sons, Inc., (New York 1994), pp. 107-180.
  • 16
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    • R.J. McCabe and M.E. Fine, "Creep of tin, Sb-solution strengthened tin, and SbSn-precipitate-strengthened tin," Metallurgical and Material Transactions, 33A(2002)pp. 1531-1539.
    • (2002) Metallurgical and Material Transactions , vol.33 A , pp. 1531-1539
    • McCabe, R.J.1    Fine, M.E.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.