NanoFlux - Doping of Solder Pastes

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 923-927

  Zerrer, Patrick ^a   Fix, Andreas ^a   Hutter, Matthias ^b   Pape, Uwe ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE ELECTRONICS; COUPLED PLASMAS; DIFFERENTIAL SCANNING CALORIMETERS; ENERGY DISPERSIVE; FATIGUE PROPERTIES; ICP-OES; IN-SITU; LEAD-FREE; LEAD-FREE SOLDERS; MICROSTRUCTURAL CHARACTERISTICS; NEW APPROACHES; SN-AG-CU; SOLDER BALLS; SOLDER JOINTS; SOLDER POWDERS; SPECIAL ELEMENTS; THERMAL CYCLE TESTS; THERMAL PROPERTIES;

ALLOYING; ALLOYING ELEMENTS; ALLOYS; ATOMIC SPECTROSCOPY; AUTOMOBILE ELECTRONIC EQUIPMENT; BRAZING; DATA STORAGE EQUIPMENT; DIFFERENTIAL SCANNING CALORIMETRY; DISSOLUTION; EMISSION SPECTROSCOPY; INDUCTIVELY COUPLED PLASMA; IRON ALLOYS; LASER INTERFEROMETRY; MELTING POINT; METALLIC COMPOUNDS; MOLECULAR SPECTROSCOPY; OPTICAL EMISSION SPECTROSCOPY; POWDERS; SCANNING; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING; SOLDERING ALLOYS; THERMODYNAMIC PROPERTIES; WELDING;

LEAD;

EID: 58149104423     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684475     Document Type: Conference Paper

References (14)

1. Anderson, I. E. et al, "Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications", J. Mater. Sci. - Mater. Electron., Vol. 18, No.1-3 (2007), pp. 55-2.
2. Korhonen, T. M.K. et al, "Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates", J. Electron. Mater., Vol. 33, No.12 (2004), pp. 1581-1588.
3. Gao, F. et al, "Microstructure and mechanical properties evolution of intermetallics between Cu and Sn-3.5Ag solder doped by Ni-Co additives", J. Electron. Mater., Vol. 35, No.5 (2006), pp. 905-911.
4. Grossmann, G. et al, "Results of comparative reliability tests on lead-free solder alloys", Proc. Electronic Components and Technology Conference, 2002, pp. 1214-1237
5. Nowottnick, M. et al, "Reaktionslote in der Elektronik - Erfahrungen und Potentiale", Proc. Elektronische Baugruppen und Leiterplatten EBL, Fellbach, Feb. 2008, pp. 165-170
6. Ahmer, S. et al, "Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish", Proc. 8th Electronics Packaging Technology Conf., 2006 pp. 84-411
7. Nishikawa, H. et al., "Morphology and pull strength of Sn-Ag(-Co) solder joint with copper pad", J. Electron. Mater., Vol. 36, No.9 (2007), pp. 1137-1143.
8. Anderson, I. E. et al, "Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying", J. Electron. Mater., Vol. 31, No.11 (2002), pp. 106-1174.
9. Law, C. M. T. et al, "Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys", J. Electron. Mater., Vol. 35, No.1 (2006), pp. 89-93.
10. Lin, K. L., "Microstructural evolution of Sn-Ag-CuAl solder with respect to Al content and heat treatment", J. Mater. Res., Vol. 17, No.9 (2006), pp. 2386-2393.
11. Wittke, K. et al, "Pikometallurgie - ein Verfahren zur Verbesserung des Krichverhaltens von Weichlötverbindungen?", VTE Aufbau und Verbindungstechnik, Vol. 13, No.6 (2001), pp. 293-304
12. Zerrer, P. et al, "Flussmitteldotierte Lotsysteme", Proc. System/Hybrid/Packaging, Nürnberg, Juni 2008, Tutorial 1
13. Fix, A.R. et al, "Ionenätzen von Weichloten für die Elektrotechnik", DGM 38. Metallographietagung, Bochum, 2004
14. Anderson, I. E. et al, "Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability", J. Electron. Mater., Vol. 30, No.9 (2001), pp. 1050-1059.