An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples

Thin Solid Films

Volumn 515, Issue 4, 2006, Pages 2781-2785

  Liao, C N ^a   Wei, C T ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Activation analysis; Electrical properties; Intermetallic compound; Thin film reaction

Indexed keywords

ACTIVATION ENERGY; ANNEALING; BIMETALS; INTERMETALLICS; REACTION KINETICS;

IN SITU RESISTIVITY MEASUREMENTS; ISOCHRONAL ANNEALING PROCESS; THIN FILM COUPLES; THIN FILM REACTION;

THIN FILMS;

EID: 33750795892     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.05.025     Document Type: Article

References (16)

1. Onishi M., and Fujibuchi H. Trans. Jpn. Inst. Met. 16 (1975) 539
2. Tu K.N., and Thompson R.D. Acta Metall. 30 (1982) 947
3. Chopra R., Ohring M., and Oswald R.S. Thin Solid Films 94 (1982) 279
4. Abel F., Cohen C., Davies J.A., Moulin J., and Schmaus D. Appl. Surf. Sci. 44 (1990) 17
5. Mei Z., Sunwoo A.J., and Morris J.W. Metall. Trans., A, Phys. Metall. Mater. Sci. 23A (1992) 857
6. Dreyer K.F., Neils W.K., Chromik R.R., Grosman D., and Cotts E.J. Appl. Phys. Lett. 67 (1995) 2795
7. Frederikse H.P.R., Fields R.J., and Feldman A. J. Appl. Phys. 72 (1992) 2879
8. Stepniak F. Microelectron. Reliab. 41 (2001) 735
9. Chan Y.C., So A.C.K., and Lai J.K.L. Mater. Sci. Eng., B, Solid-State Mater. Adv. Technol. 55 (1998) 5
10. Liu C.Y., Chen C., Mal K., and Tu K.N. J. Appl. Phys. 85 (1990) 3882
11. Tu K.N. Acta Metall. 21 (1973) 347
12. Chopra R., and Ohring M. Thin Solid Films 86 (1981) 43
13. Dhabal S., and Ghosh T.B. Appl. Surf. Sci. 211 (2003) 13
14. Gösele U., and Tu K.N. J. Appl. Phys. 53 (1982) 3252
15. Tu K.N., Mayer J.M., and Feldmann L.C. Electronic thin film science (1992), Macmillan, New York 330
16. Kim H.K., and Tu K.N. Phys. Rev., B 53 (1996) 16027