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Journal of Electronic Materials

Volumn 37, Issue 6, 2008, Pages 837-844

Fabrication and microstructures of sequentially electroplated Sn-Rich Au-Sn alloy solders

(4) Tang, Wenming a He, Anqiang a Liu, Qi a Ivey, Douglas G a

a UNIVERSITY OF ALBERTA (Canada)

Author keywords

Au Sn alloys; Electrodeposition; Microstructure; Phase analysis; Reflow; Solder

Indexed keywords

HYPEREUTECTICS; PHASE ANALYSIS; PHASE ZONES; ROOM TEMPERATURE;

ELECTROPLATING; EUTECTICS; MICROFABRICATION; MICROHARDNESS; MICROSTRUCTURE; PHASE COMPOSITION; SOLDERING ALLOYS;

TIN ALLOYS;

EID: 42449152782 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0401-z Document Type: Article

Times cited : (19)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.