Design of an efficient microwave plasma reactor for bulk production of inorganic nanowires

Informacije MIDEM

Volumn 38, Issue 4, 2008, Pages 237-243

  Kim, Jeong H ^a   Kumar, Vivekanand ^a   Chernomordik, Boris ^a   Sunkara, Mahendra K ^a  

^a University of Louisville   (United States)

Author keywords

Argon; Atmospheric pressure; Metal oxide; Microwave; Nanoparticle; Nanowire; Oxygen; Plasma

Indexed keywords

EID: 75449115571     PISSN: 03529045     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (57)

1. K. Ostrikov and A. B. Murphy, J. Phys. D: Appl. Phys., vol.40, pp. 2223-2241, 2007.
2. S. Sharma and M. K. Sunkara, Nanotechnology, vol.15, pp. 130-134, 2004.
3. K. Ostrikov, Rev. Mod. Phys., vol.77, no.2, pp. 489-511, 2005.
4. E. Tam, I. Levchenko and K. Ostrikov, J. Phys. D: Appl. Phys., vol.100, no.3, art. no. 036104, 2006.
5. U. Cvelbar, K. Ostrikov and M. Mozetic, Nanotechnology, vol.19, no.40, art. no. 405605, 2008.
6. J. C. Ho, I. Levchenko, and K. Ostrikov, J. Appl. Phys., vol.101, art. no.094309, 2007.
7. Q.J. Cheng, S. Xu, J.D. Long et al., Appl. Phys. Lett., vol.90, no.17, art. no. 173112, 2007.
8. I. Levchenko, A.E. Rider, and K. Ostrikov, Appl. Phys. Lett., vol.90, no.19, art. no. 193110, 2007.
9. K. Ostrikov, Z.L. Tlakatze, P. P. Rutkevych, J. D. Long, S. Xu, I. Denysenko, Cont. to Plasma Phys., vol.45, pp. 514-521, 2005.
10. I. B. Denysenko, S. Xu, J. D. Long, P. P. Rutkevych, N. A. Azarenkov, and K. Ostrikov, J. Appl. Phys., vol.95, pp. 2713-2724, 2004.
11. I. Levchenko et al., J. Phys. D : Appl. Phys., vol.41, no.13, art. no. 132004, 2008.
12. I. Denysenko et al., J. Appl. Phys., vol.104, no.7, art. no. 073301, 2008.
13. U. Cvelbar, S. Pejovnik, M. Mozetic, and A. Zalar, Appl. Surf. Sc., vol.210, pp. 255-261, 2003.
14. J.-H. Kim, G. Liu, and S. H. Kim, J. Mater. Chem., vol.16, pp. 977-981, 2006.
15. C Canal, F. Gaboriau, S. Villeger et al., Int. J. Pharm., vol.367, no.1-2, pp. 155-161, 2009.
16. C Canal, F. Gaboriau, A. Ricard et al., Plasma Chem. Plasma Proces., vol.27, no.4, pp. 404-413, 2007.
17. A. Ricard et al., Plasma Chem. Plasma Proces., vol.5, no.9, pp. 867-873, 2008.
18. C Canal, R. Molina, P. Erra, and A. Ricard, Eur. Phys. J. Appl. Phys., vol.36, no.35-36, 2006.
19. J. H. Hsieh and C. Li, Thin Solid Films, vol.504, pp. 101-103, 2006.
20. M. Mafra et al., Key Eng. Mater., vol.373-374, pp. 421-425, 2008.
21. N. Krstulović, I. Labazan, S. Milosevic et al, J. Phys. D : Appl. Phys., vol.39, pp. 3799-3804, 2006.
22. T. Vrlinic et al., Surf. Interface Anal., vol.39, no.6, pp. 467-481, 2007.
23. U. Cvelbar et al., Appl. Surf. Sci., vol.253, no.21, pp. 8669-8673, 2007.
24. C Canal, S. Villeger, S. Cousty, B. Rouffet, J.P. Sarrette, P. Erra, A. Ricard, Appl. Surf. Sci., vol.254, no.18, pp. 5959-5966, 2008.
25. U. Cvelbar Sci., B. Markoli, I. Poberaj, A. Zalar, L Kosec, and S. Spaic, Appl. Surf. Sci., vol.253, pp. 1861-1865, 2006.
26. A. Vesel et al., Surf. Interface Anal., vol.40, no.11, pp. 1444-1453, 2008.
27. D. Mariotti, H. Lindstrom, A.C. Bose, Nanotechnology, vol.19, no.49, 495302, 2008.
28. S. Gubbala, V. Chakrapani, V. Kumar, and M. K. Sunkara, Adv. Func Mater., vol.18, pp. 2411-2418, 2008.
29. P. Meduri, C. Pendyala, V. Kumar, G. U. Sumanasekera, and M. K. Sunkara, Nano Lett., vol.9, pp. 612-616, 2009.
30. S. R. C. Vivekchand, K. C. Kam, G. Gundiah, A. Govindaraj, A. K. Cheetham, and C. N. R. Rao, J. Mater. Chem., vol.15, pp. 4922-4927, 2005.
31. U. Cvelbar, M. Mozetic, and M.KIanjsek Gunde, IEEE Trans. Plasm. Sci., vol.33, no.2, pp. 236-237, 2005.
32. M. KlanjsekGunde, M. Kunaver et al., Prog. Ora. Coat, vol.54, no.2, pp. 12-16, 2006
33. B. Deb, S. Desai, G. U. Sumanasekera, and M. K. Sunkara, Nanotechnology, pp. 285501-285507, 2007.
34. U. Cvelbar, K. Ostrikov, A. Drenik, and M. Mozetic, Appl. Phys. Lett., vol.93, no.13, art. no. 133505, 2008.
35. A. Drenik, U. Cvelbar, K. Ostrikov, and M. Mozetic, J. Appl. Phys.D : Appl. Phys., vol.41, no.11, art. no. 115201, 2008.
36. R. S. Wagner and W. C Ellis, Appl. Phys. Lett., vol.4, pp. 89-90, 1964.
37. B. D. Yao, Y. F. Chan, and N. Wang, Appl. Phys. Lett., vol.81, pp. 757-759, 2002.
38. A. M. Morales and C. M. Lieber, Science, vol.279, pp. 208-211, 1998.
39. Z. Li, X. Huang, J. Liu, and H. Ai, Mater. Lett., vol.62, pp. 2507-2511, 2008.
40. M. Zhang, Y. Bando, and K. Wada, J. Mater. Sc Lett., vol.20, pp. 167-170, 2001.
41. M. Mozetic, U. Cvelbar, M. K. Sunkara, and S. Vaddiraju, Adv. Mater., vol.17, pp. 2138-2142, 2005.
42. U. Cvelbar et al., Small, vol.4, no.4, pp. 1610-1614, 2008.
43. Z.Q. Chen et al., Chem. Mater., vol.20, no.9, pp. 3224-3228, 2008.
44. U. Cvelbar and K. Ostrikov, Cryst. Growth Des., vol.8, no.12, pp. 4347-4349, 2008.
45. V. Kumar, J. H. Kim, C Pendyala, B. Chemomordik, and M. K. Sunkara, J. Phys. Chem. C, vol.112, pp. 17750-17754, 2008.
46. V. Hody et al., Plasma Chem. Plasma Process, vol.26, no.3, pp. 251-266, 2006.
47. G. Arnoult, R.P. Cardoso, T. Belmonte and G. Henrion, Appl. Phys. Lett., vol.93, no.19, art. no. 191507, 2008.
48. T. Belmonte, R.P. Cardoso, G. Henrion, and F. Kosior, J. Phys. D: Appl. Phys., vol.40, no.23, pp. 7343-7356, 2007.
49. J. B. Donnet, H. Oulanti, T. L Huu, and M. Schmitt, Carbon, vol.44, pp. 374-380, 2006.
50. M. Mozetic, A. Vesel, U. Cvelbar et al., Plasma Chem. Plasma Process., vol.26, no.2, pp. 236-237.
51. M. Mozetic, U. Cvelbar, A. Vesel, et al., J. Appl. Phys., vol.97, no.10, art. no. 103308, 2005.
52. K.N. Ostrikov, S. Xu, M.Y. Yu, J. Appl. Phys., vol.88, no.5, pp. 2268-2271, 2000.
53. A. Ricard, F. Gaboriau, and C. Canal, Surf. Coat. Tech., vol.202, pp. 5220-5224, 2008.
54. S.V. Vladimirov et al., Phys. Rev. E, vol.58, no.6, pp. 8046-8048, 1998.
55. K.N. Ostrikov, M.Y. Yu and H. Sugai, J. Appl. Phys., vol.86, no.5, pp. 2425-2430, 1999.
56. H. Peng, Y. Fangli, B. Liuyang, L Jinlin, and C. Yunfa, J. Phys. Chem. C, vol.111, pp. 194-200, 2007.
57. R.P. Cardoso, T. Belmonte, P. Keravec, F. Kosiorand G. Henrion, J. Phys.D: Appl. Phys., vol.40, no.5, pp. 1394-1400, 2007.