Effects of hollow cathode and Ar/H2 ratio on plasma cleaning of Cu leadframe

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 101-103

  Hsieh, J H ^a   Li, C ^b  

^a MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Copper oxide; Hollow cathode; Plasma cleaning; Plasma density

Indexed keywords

CATHODES; CLEANING; OXIDES; PLASMA APPLICATIONS; PLASMA DENSITY;

COPPER OXIDE; HOLLOW CATHODE; PLASMA CLEANING;

COPPER;

EID: 33644906359     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.050     Document Type: Conference Paper

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