Development of LTCC-Materials and their applications - An overview

Informacije MIDEM

Volumn 38, Issue 4, 2008, Pages 219-224

  Kita, Jaroslaw ^a   Moos, Ralf ^a  

^a UNIVERSITY OF BAYREUTH   (Germany)

Author keywords

Applications; LTCC materials; Overview; Sintering; Thick film conductors

Indexed keywords

EID: 75449107380     PISSN: 03529045     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (73)

1. Rabe T., Schiller W.A., Hochheimer T., Modes C., KipkaA., Zero Shrinkage of LTCC by Self-Constrained Sintering, Int. J. Appl. Ceram. Technol., 2, 2005, p. 374-382, doi:10.1111/j.1744-7402.2005.02038.x,
2. Valant M., SuvorovD., Pullar R.C., Kumaravinothan Sarma, McN. Alford N., A mechanism for low-temperature sintering, J. Europ. Cer. Soc., 26, 2006, pp. 2777-2783, doi:10.1016/j.jeurceramsoc.2005.06.026
3. Kemethmüller S., Hagymasi M., Stiegelschmitt A., Roosen A., Viscous Flow as the Driving Force for the Densification of LowTemperature Co-Fired Ceramics, J. Am. Ceram. Soc., 90, 2007, p. 64-70, doi: 10.1111/j.1551-2916.2006. 01362.x (Pubitemid 46087938)
4. Mohanram A., Messing, G.L. Green D.J., Densification and Sintering Viscosity of Low-Temperature Co-Fired Ceramics, J. Am. Cer. Soc., 88, 2005, p. 2681-2689, doi:10.1111/j.1551-2916. 2005.00497.x
5. Wahlers R.L, Feingold A.H., Heinz M., Lead Free, Zero Shrink, Substrate Bonded LTCC System, Proc. Int. Symp. On Microel. IMAPS, USA
6. Hintz M., Thust H., Polzer E., Generic investigation on O - shrinkage processed LTCC, Proc. IMAPS Nordic, Stockholm 2002, p. 243-249
7. Mohanram A., Lee S.-H., Messing, G.L. Green D.J., Green, Constrained Sintering of Low-Temperature Co-Fired Ceramics, J. Am. Cer. Soc., 89, 2006, pp. 1923-1929, doi:10.1111/j.1551-2916.2006.01079.x
8. Barnwell P., Amaya E., Lautzenhiser, F., Wood J., HeraLock TM 2000 Self-constrained LTCC Tape -Benefits and Application, Proc. IMAPS Nordic, Stockholm 2002, pp. 250-256.
9. Lautzenhiser F., Amaya E., Hochheimer T.J., Self-constrained low temperature glass-ceramic unfired tape for microelectronics and method for making and using the same, US Patent Application 2003/0087136A1.
10. Lautzenhiser F., Amaya E., Barnwell P., Wood J., Microwave module design with Heralock HL2000 LTCC, Proc. 35th International Symposium on Microelectronics, IMAPS 2002, Denver, Colorado, pp. 285-291.
11. Tape Composition and Process for Internally Constrained Sintering of Low-Temperature Co-Fired Ceramic, US Patent Application 2004/6776861B1
12. Liao C. Jean J., Hung Y., Self-Constrained Sintering of a Multilayer Low-Temperature-Cofired Glass-Ceramics /Alumina Laminate, J. Am. Cer. Soc., 4, 2007, p. 1-4,
13. Jantunen H., Hu T., Uusimäki A., Leppãvuori S., Tape casting of ferroelectric, dielectric, piezoelectric and ferromagnetic materials, J. Europ. Cer. Soc., 24, 2004, p. 1077-1081, doi:10.1016/S0955-2219(03)00552-1
14. Feingold A.H., Heinz M., Wahlers R.L., Stein M.A., Compliant Dielectric and Magnetic Materials for buried Components, Proc Int. Symp. On Microel. IMAPS, Denver, USA, 2002
15. Feingold A.H. Heinz M., Wahlers R.L, Stein M.A., Materials for Capacitive and Inductive Components Integrated with Commercially Available LTCC Systems, Proc. Int. Symp. On Microel. IMAPS Israel Chapter, 2003
16. Choi Y., Park J.-H., Park J.-H., Park J.-G., Middle-permittivity LTCC dielectric compositions with adjustable temperature coefficient, Mat. Let., 58, 2004, p. 3102-3106, doi:10.1016/j.matlet.2004.05.049
17. 9-Based Middle-k Dielectric Compo-sition for LTCC Applications, J. Electrocer., 14, 2005, p. 157-162,
18. Choi Y., Park J.-H., Park J.-H., Nahm S., Park J.-G., Middleand high-permittivity dielectric compositions for low-temperature co-fired ceramics, J Europ. Cer. Soc., 27, 2007, p. 2017-2024, doi:10.1016/j.jeurceramsoc.2006.05. 104 (Pubitemid 44835448)
19. 3 ceramics with glass addition for internal capacitor of LTCC, J. Alloys and Comp., 459, 2008, p. 307-310
20. 18 ceramics for LTCC applications, J. Europ. Cer. Soc., 28, 2008, p. 2777-2782, doi:10.1016/j.jeurceramsoc.2008.04.021
21. r base material for wireless communications, J. Europ. Cer. Soc., 27, 2007, p. 2785-2788, doi:10.1016/j.jeurceramsoc.2006.11.048
22. Zhang Q.L, Yang H., Zou J.L, Wang H.P, Sintering and microwave dielectric properties of LTCC-zinc titanate multilayers, Mat. Letters, 59, 2005, p. 880-884, doi:10.1016/j.matlet.2004.11.036 (Pubitemid 40206117)
23. 3-based LTCC materials, J. Electrocer. online, 2007, doi:10.1007/s10832-007-9096-4,
24. Hong S.H., Park J.H., Choa Y.H, Kim J., Magnetic properties and sintering characteristics of NiZn(Ag, Cu) ferrite for LTCC applications, J. Magnetism and Magnetic Mat., 290-291, 2005, p. 1559-1562, doi:10.1016/j.jmmm.2004.11.242,
25. Matz R., Götsch D., Karmazin D., Männer R. Siessegger B., Low temperature cofirable MnZn ferrite for power electronic applications, J. Electrocer. online, 2007, doi:10.1007/s10832-007-9334-9
26. Karmazin R., Dernovsek O., Ilkov N., Wersing W., Roosen A., Hagymasi M., New LTCC-hexaferrites by using reaction bonded glass ceramics, J. Europ. Cer. Soc., 25, 2005, p. 2029-2032, doi:10.1016/j.jeurceramsoc.2005.03.064 (Pubitemid 40829584)
27. Weng Y.L., Ollivier P.J., Skurski M.A., Photoformed thick Im materials and their application to ne feature Circuitry, Proc. of the 2000 Int. Conf. on High-Density lnterc and System Packag., Denver, 2000, p. 579-584
28. Skurski M.A., Smith M.A., Draudt R.R., Amey D.I., Horowitz M.J., Champ M.J., Photoimageable Silver Cofireable Conductor Compatible With 951 Green TapeTM, Proc. Proc. Int. Symp. On Microel. IMAPS, San Diego, USA 1998,
29. Bacher R.J., Wang Y.L., Skurski M.A., Crumpton J.C., Nair K. M., Next Generation Ceramic Multilayer Systems, Proc. Int. Symp. On Microel. IMAPS 2000, Boston, USA
30. Kautio K., Properties of High Definition Photoimaged Conductors in LTCC, Proc 38th IMAPS Nordic 2002 Conference, Stockholm, p. 227-232,
31. Weber J., Röthlingshöfer W., Goebel U., Innovative Anwendungen der LTCC-Technologie im Automobilbau, Conf. "Folien- und Multilayer-technologie", 10. April 2003, Berlin (in German),
32. Dziedzic A. et al. Electrical and stability properties and ultrasonic microscope characterisation of low temp-erature co-red resistors, Microelectr. Reliab., 2001, 41, p. 669-676
33. Dziedzic A., Rebenklau L, Golonka L.J., Wolter K.-J., Fodel microresistors-processing and basic electrical properties, Microelec Rel., 43, 2003, p. 377-383, doi:10.1016/S0026-2714(02)00346-3
34. Kita J., Dziedzic A., Golonka L.J., Non-conventional Application of Laser in Thick-film Technology - Preliminary Results, Proc. 23rd International Spring Seminar on Electronics Technology ISEE'2000, Balatonfüred, Hungary, pp. 219-223,
35. Gollner E., Kita J., Moos R., Frequency-tripled Nd:YAG-laser in thick-film and LTTC applications, Proc. XXX Int. Conf. IMAPS Poland Chapter, Krakow, Poland, 2006, p.147-152
36. Kita J., Rettig F., Moos R., Drue K.-H., Thust H., Hot Plate Gas Sensors -Are Ceramics Better?, Int. J. Appl. Cer. Techn., 2, 2005, p. 383-389, doi: 10.1111/j.1744-7402.2005.02037.x
37. Mis E., Dziedzic A., Piasecki T., Kita J., Moos R., Geometrical, electrical and stability properties of thick-im and LTCC microcapacitors, Microel. International, 25, 2008, p. 37-41
38. Ba̧k M., Dudek M., Dziedzic A., Kita J., Chosen electrical and stability properties of laser-shaped thick-film and LTCC inductors, Proc. ESTC 2008 Conference (will be published)
39. Nowak D., Józenków T., Dziedzic A., Kita J., Miniaturization of Thick-Film and LTCC Resistors by Laser-Shaping, Proc. IMAPS-CPMT Conference, Pultusk, Poland, 2008 (will be published)
40. Birol H., Maeder T., Ryser P., Processing of Graphite-Based Sacrificial Layer for Microfabrication of Low Temperature Co-fired Ceramics (LTCC), Sens. and Act. A, 130-131, 2006, p. 560-567 (Pubitemid 44063530)
41. Birol H., Maeder T., Ryser P., Application of graphite-based sacrificial layers for fabrication of LTCC (low temperature co-fired ceramic) membranes and micro-channels, J. Micromech. Microeng., 17, 2007, p. 50-60 (Pubitemid 46476587)
42. Espinoza-Vallejos P., Zhong, J., Gongora-Rubio M., Sola-Laguna L, Santiago-Aviles J., The Measurement and Control of Sagging in Meso electromechanical LTCC Structures and Systems, Proc. Mat. Research Soc. Symp., Warrendale, USA, 1998, p. 73-79
43. Espinoza-Vallejos P., Santiago-Aviles J., Photolitho-graphic Feature Fabrication of LTCC, Int. J. Microcirc and Electron. Packag., 23, 2000, p.286-289
44. Moos R. Kita J., Integration von bereits gebrannten Substratkeramikem mit LTCC-Folien, DE Patent Application 2006, DE102006021432A1,
45. Kita J., Rettig F., Moos R., Integration of Fired Ceramics on LTCC Structures - Feasibility Study, Proc. EMPS 2006, 4th Europ. Microel. and Packag. Symp., Terme Catez, Slovenia, 2006, p.51-55
46. 2 gas sensor on low temperature cofiring ceramics, Sens, and Act. B, 47, 1998, p. 100-103, doi:10.1016/S0925- 4005(98)00008-2
47. Rettig F., Moos R., Ceramic meso hot-plates for gas sensors, Sensors and Actuators B: Chemical, 103, 2004, p. 91-97, doi:10.1016/j.snb.2004.04.040 (Pubitemid 40329191)
48. Bansky J., Pietrikova A., Urbancik J., Unconventional Application of Low Temperature Co-fired Ceramics in Thick-Film Gas Sensors, Proc Int. Symp. On Microel. IMAPS Poland Chapter, Polanczyk, 2001
49. Kita J., Dziedzic A., Friedel K., Golonka L.J., Janus P., Szeloch R., Surface temperature distribution analysis in sensors with buried heater made in LTCC technology, Proc. 13th European Microel. & Pack. Conf., Strasbourg (France), 2001, p. 123-128
50. Pisarkiewicz T., Sutor A., Maziarz W., Thust H., Thelemann T., Thin Film Gas Sensor on Low Temperature Co-fired Ceramics, Proc. European Microelectronics Packaging and Interconnection Symposium, Prague 2000, p. 399-403
51. nd Int. Spring Sem. On Electron. Technol., Dresden, Germany, 1993, p.111-115
52. Khanna P. K., Hornbostel B., Grimme R., Schäfer W., Domer J., Miniature pressure sensor and micromachined actuator structure based on low-temperature-cofired ceramics and piezoelectric material, Mat. Chemistry and Physics, 87, 2004, p. 173-178, doi:10.1016/j.matchemphys.2004.05.021
53. Meijerink M.G.H., Nieuwkoop E., Veninga E.P., Meuwissen M.H.H., Tijdink M.W.W.J., Capacitive pressure sensor in postprocessing on LTCC substrates, Sens, and Act. A, 123-124, 2005, p. 234-239, doi:10.1016/j.sna.2005.04.026
54. Hrovat M., Belavic D., Bencan A., Bernard J., Hole J., Cilensek J., Smetana W., Homolka H., Reicher R., Golonka L, Dziedzic A., Kita J., Thick-film resistors on various substrates as sensing elements for strain-gauge applications, Sens, and Act. A, 107, 2003, p. 261-272, doi:10.1016/j.sna.2003. 07.003
55. Lynch H., Park J., Espinoza-Valejos P.A., Santiago-Aviles J.J., Sola-Laguna L., Meso-Scale Pressure Trasducer Utilizing Low Temperature Co-Fired Ceramic Tapes, Proc. Int. Symp. On Microel. IMAPS, USA
56. Golonka L.J., Dziedzic, Roguszczak H., Tankiewicz S., Terech D., Novel technological and constructional solutions of pressure sensors made in LTCC technology, Proc. of SPIE, 2000, vol.4516, p.10-14, (Pubitemid 32993683)
57. Birol H., Maeder T., Nadzeyka I., Boers M., Ryser P., Fabrication of a millinewton force sensor using low temperature co-fired ceramic (LTCC) technology, Sens, and Act. A, 134, 2007, p. 334-338, doi:10.1016/j.sna.2006.05. 025 (Pubitemid 46349555)
58. Hrovat M., Belavič D., Kita J., Cilenšek J., Golonka L., Dziedzic A., Thick-film temperature sensors on alumina and LTCC substrates, J. Europ. Cer. Soc., 25, 2005, pp. 3443-3450, doi:10.1016/j.jeurceramsoc.2004.09. 027 (Pubitemid 41086642)
59. Hrovat M., Belavič D., Kita J., Hole J., Cilenšek J., Golonka L., A. Dziedzic, Thick-film PTC thermistors and LTCC structures: The dependence of the electrical and microstructural characteristics on the firing temperature, J. Europ. Cer. Soc., 27, 2007, pp. 2237-2243, doi:10.1016/j. jeurceramsoc.2006.08.005 (Pubitemid 44933061)
60. Martinez-Cisneros CS., Ibáńez-García N., Valdés F., Alonso J., LTCC microflow analyzers with monolithic integration of thermal control, Sens. and Act. A, 138, 2007, p. 63-70, doi:10.1016/j.sna.2007.04.059 (Pubitemid 47002260)
61. Goldbach M., Axthelm H., Keusgen M., LTCC-based microchips for the electrochemical detection of phenolic compounds, Sens, and Act. B, 120, 2006, p. 346-351, doi:10.1016/j.snb.2006.01.047 (Pubitemid 44486676)
62. Wang X., Zhu J., Bau H., Gorte R.J, Fabrication of Micro-Reactors Using Tape-Casting Methods, Cat. Letters, 77, 2001, p. 173-177, doi:10.1023/A: 1013236306883 (Pubitemid 33617961)
63. Baker A., Lanagan M., Randall C., Semouchkina E., Semouchkin G., Rajab K.Z., Eitel R., Mittra R., Rhee S., Geggier, P. Duschl C., Fuhr G., Integration Concepts for the Fabrication of LTCC Structures, Int. J. Appl. Cer. Techn., 2, 2005, p. 514-520, doi:10.1111/j.1744-7402.2005.02052.x
64. Achmann S., Hämmerte M., Kita J., Moos R., Miniaturized Low Temperature Co-red Ceramics (LTCC) Biosensor for Amperometric Gas Sensing, Sens. And Act. B, 2008, in Press, doi: 10.1016/j.snb.2008.07.024
65. Gongora-Rubio M.R., Kofuji S.T., Seabra A.C. Hernandez E., Simoes E.W., Fontes M., Verdonck P., LTCC Sensors for Environmental Monitoring System, Proc. Ceram. Intercon. and Ceram. Packag. Conf. CICMT 2005
66. Chaudhary A., van Amerom F.H.W., Short R.T., Bhansali S., Fabrication and testing of a miniature cylindrical ion trap mass spectrometer constructed from low temperature co-fired ceramics, International J. Mass Spectr., 251, 2006, p. 32-39, doi:10.1016/j.ijms.2005.12.013
67. Jihua Zhong, Mingqiang Yi, Haim H. Bau, Magneto hydrodynamic (MHD) pump fabricated with ceramic tapes, Sens, and Act. A, 96, 2002, p. 59-66, doi:10.1016/S0924-4247(01)00764-6
68. AguilarZ. P., Arumugam P., Fritsch I., Study of magnetohydrodynamic driven flow through LTCC channel with self-contained electrodes, J. Electroanal. Chem., 591, 2006, p. 201-209, doi:10.1016/j.jelechem.2006.04.019 (Pubitemid 44172883)
69. Santiago-Aviles J.J., Gongora-Rubio M., Espinoza-Vallejos P., Sola-Laguna L., Sensors, Actuators and Other Non-Packaging Applications of LTCC Tapes, Proc. Ceram. Intercon. & Ceram. Packag. Conf. CICMT, Denver, USA, 2004, p. 07-12
70. Gongora-Rubio M., Sola-Laguna L. Smith M., Santiago-Aviles J.J., A Meso-scale Electromagneti-cally Actuated Normally Closed Valve Realized on LTCC Technology, Proc. of SPIE, Conf. on Microfluidic Device and Systems II, Santa Clara, USA, 1999, vol.SPIE 3877, pp. 230-239,
71. Rebenklau L., Wolter K.-J., Howitz S., Realization of Hybrid Microfluidic Systems Using Standard LTCC Process, Proc 50th ECTC IEEE Conf., Las Vegas, USA, 2000, p. 1696-1700,
72. Peterson K.A., Rohde S.B., Walker C.A., Patel K.D., Turner T.S., Nordquist CD., Microsystem Integration with new Techniques in LTCC, Proc. Ceram. Interconn. and Ceram. Packag. Conf. CICMT - Baltimore, 2004
73. Li J., Ananthasuresh G.K., Three-dimensional Low-Temperature Co-fired Ceramic Shells for Miniature System Applications, J. Micromech. Microeng., 12, 2002, p. 198-203 (Pubitemid 34575149)