Microwave module design with HeraLock™ HL2000 LTCC

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 285-291

  Lautzenhiser, Frans ^a   Amaya, Edmar ^a   Barnwell, Peter ^a   Wood, Jim ^a  

^a Heraeus CMD   (United States)

Author keywords

Cavity structures; Constrained sintering; Embedded passives; LTCC; Microwave; RF materials

Indexed keywords

CERAMIC MATERIALS; ELECTRIC LOSSES; INTEGRATED CIRCUIT LAYOUT; LOW TEMPERATURE ENGINEERING; MICROWAVE INTEGRATED CIRCUITS; NATURAL FREQUENCIES; PASSIVE NETWORKS; SCANNING ELECTRON MICROSCOPY; SHRINKAGE; SINTERING;

CONSTRAINED SINTERING; LOW TEMPERATURE COFIRED CERAMIC;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036450342     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Frans Lautzenhiser & Edmar Amaya, "HeraLock™ 2000 Self-constrained LTCC Tape," Proceedings of the 2002 International Conference on Advanced Packaging and Systems (ICAPS), Reno, Nevada; March 12-13, pp. 143-9, 2002.
2. Mike Barker & Rick Draudt, "Zero Shrink Process for Cost Sensitive High Volume LTCC Applications," Proceedings of the 2001 International Symposium on Microelectronics (IMAPS), October 9-11, pp. 26 - 31, 2001.
3. Edmar Amaya, Peter Barnwell & Frans Lautzenhiser, "Designing with HeraLock™ HL2000 Self-constrained LTCC Tape", Final Program, Advanced Technology Workshop on Ceramic Applications for Microwave and Photonic Packaging, May 2-3, Providence, RI, 2002
4. S. Shih, A. Becker, Y. Lee & A.M. Lyons, "Design and Characterization of Broadband High Frequency Transmission Lines on Low Loss LTCC," Proceedings of the Ceramic Applications for Microwave and Photonic Packaging, May 2-3, Providence, RI, 2002.