LTCC system with new high-εr and high-Q material co-fired with conventional low-εr base material for wireless communications

Journal of the European Ceramic Society

Volumn 27, Issue 8-9 SPEC. ISS., 2007, Pages 2785-2788

  Higuchi, Yukio ^a   Sugimoto, Yasutaka ^a   Harada, Jun ^a   Tamura, Hiroshi ^a  

^a MURATA MANUFACTURING CO LTD   (Japan)

Author keywords

LTCC system

Indexed keywords

CAPACITANCE; FILLER METALS; FIRING (OF MATERIALS); GLASS; HEAT RESISTANCE; LOW TEMPERATURE PROPERTIES; PERMITTIVITY; SINTERING; WIRELESS TELECOMMUNICATION SYSTEMS;

HIGH QUALITY FACTOR; LOW TEMPERATURE COEFFICIENT OF CAPACITANCE; MINIATURIZATION;

REFRACTORY MATERIALS;

CAPACITANCE; FILLER METALS; FIRING (OF MATERIALS); GLASS; HEAT RESISTANCE; LOW TEMPERATURE PROPERTIES; PERMITTIVITY; REFRACTORY MATERIALS; SINTERING; WIRELESS TELECOMMUNICATION SYSTEMS;

EID: 33947623738     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2006.11.048     Document Type: Article

References (4)

1. Flaiz, P., Flanagan, A., Harvilchunk, J., Herron, L., Knickerbocker, J., Nufer, R., Perry, C., Reddy, S., Method and Means for Co-sintering Ceramic/Metal MLC Substrate. US Patent 5,130,067, 1992.
2. Mikeska, K. R., Schaefer, D. T., Method for Reducing Shrinkage during Firing of Ceramic Bodies. US Patent 5,254,191, 1993.
3. Imanaka Y. Multi-layered Low Temperature Co-fired Ceramics (LTCC) Technology (2005), Springer Chapter 4, p. 87
4. Otagiri T. Technologies & applications of multi-layered low temperature cofired ceramics (in Japanese). CMC (2005) 179-190