Thermomechanical reliability study of flip chip solder bumps: Using laser ultrasound technique and finite element method

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 4, 2009, Pages 729-739

  Yang, Jin ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Finite element (FE); Flip chip package (FCP); Laser ultrasound; Quality inspection; Reliability; Solder bump

Indexed keywords

FINITE ELEMENTS; FLIP-CHIP PACKAGES; LASER ULTRASOUND; QUALITY INSPECTION; SOLDER BUMP;

ACOUSTIC WAVES; CRACK DETECTION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFEROMETERS; LASER INTERFEROMETRY; PACKAGING; PULSED LASER APPLICATIONS; PULSED LASERS; QUALITY CONTROL; RELIABILITY; SOLDERING; THERMAL CYCLING; THREE DIMENSIONAL; ULTRASONIC APPLICATIONS; ULTRASONIC EQUIPMENT; ULTRASONIC TRANSMISSION; ULTRASONICS;

NEODYMIUM LASERS;

EID: 74649084179     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2025889     Document Type: Article

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