Fracture behaviour of flip chip solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1299-1306

  Wiese, S ^a   Jakschik, S ^a   Feustel, F ^a   Meusel, E ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; FINITE ELEMENT METHOD; FORCE MEASUREMENT; FRACTURE MECHANICS; HYSTERESIS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE TESTING; SOLDERED JOINTS; STIFFNESS;

FLIP CHIP SOLDER JOINTS; FORCE DISPLACEMENT HYSTERESIS; ISOTHERMAL CYCLIC SHEAR;

FLIP CHIP DEVICES;

EID: 0034834934     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Effect of temperature on isothermal fatigue of solders
2. Fatigue crack growth rate in 63Sn37Pb solder joints
3. Energy approach to the fatigue of 60/40 solder: Part I - Influence of temperature and cycle frequency
4. Fatigue cracking kinetics and life-time prediction of electronic solder joints
5. Experimental characterization of material properties of 63Sn37Pb flip chip solder joints
6. Constitutive behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
7. Fracture and damage evaluation in chip scale packages and flip-chip-assemblies by FEA and MicroDAC