Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 1, 2006, Pages 13-19

  Zhang, Lizheng ^a   Ume, I Charles ^a   Gamalski, Juergen ^b   Galuschki, Klaus Peter ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b SIEMENS AG   (Germany)

Author keywords

Flip chip solder joints; Signal to noise ratio; Vibrometer

Indexed keywords

CORRELATION METHODS; CRACKS; NONDESTRUCTIVE EXAMINATION; PULSED LASER APPLICATIONS; SIGNAL TO NOISE RATIO; SOLDERED JOINTS; ULTRASONICS; VIBRATION MEASUREMENT;

FLIP CHIP SOLDER JOINTS; LASER ULTRASOUND SIGNALS; ORIGINAL EQUIPMENT MANUFACTURERS ASSEMBLY; VIBROMETER;

FLIP CHIP DEVICES;

EID: 33644792086     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848567     Document Type: Article

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