Vibration analysis based modeling and defect recognition for flip-chip solder-joint inspection

Journal of Electronic Packaging

Volumn 124, Issue 3, 2002, Pages 221-226

  Liu, Sheng ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041870450     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1464878     Document Type: Article

References (14)

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2. Edward, S., 1991, "X-Ray Systems Keep Pace with SMT," Test Meas. World, Feb.
3. Adams, Tom, 1995, "Acoustic micro imaging of flip chip interconnects," III-Vs Review, 8, No. 5, Oct., pp. 50-52.
4. Semmens, Janet E., and Kessler, Lawrence W., 1997, "Further investigation into the use of acoustic micro imaging for analyzing flip chip integrity and failure modes," Proceedings of SPIE, pp. 165-169.
5. Kubota, J., Musha, Y., and Takahashi, M., 1992, "Imaging flaws in soldered joints of integrated circuits using an ultrasound electronic scanning technique," IEEE Trans. Ultrason. Ferroelectr. Freq. Control, 39(1), Jan., pp. 122-126.
6. Newman, K. E. et al., 1998, "Parallel Test Method for MCM Substrate Interconnection Networks," Int. J. Microcircuits Electron. Packag., 21(2).
7. Vanzetti, Ricardo, and Traub, Alan C., 1989, "Laser induced infrared signature: the stepping stone to statistical process control for PTH, SMT, FPT and TAB," International SAMPE Symposium and Exhibition, CA, pp. 130-140.
8. Yojima, M., Juzumi, H., and Nishiyama, T., 1998, "Non-contact LSI-package solder-joint inspection method using an electro-optic probe," Proceedings of SPIE - The International Society for Optical Engineering, Vol. 3582, pp. 132-137.
9. Lau, John, and Keely, A. Catherine, 1989, "Dynamic characterization of surface-mount component leads for solder joint inspection," IEEE Transaction of Surface-Mount Component Leads for Solder Joint Inspection, 12, Dec., pp. 594-602.
10. Timoshenko, S., and Woinwsky-Krieger, S., 1959, Theory of Plates and Shells, McGraw-Hill, New York.
11. Gorman, Daniel J., 1982, Free Vibration Analysis of Rectangular Plates, Elsevier, North Holland.
12. Liu, Erdahl, Ume and Achari, 2000, "A Novel Method and Device for Solder Joint Quality Inspection by using Laser Ultrasound," IEEE ECTC 2000 Conference, Las Vegas, May.
13. Scruby, C. B., and Drain, L. E., 1990, Laser Ultrasonics: Techniques and Applications, Adam Hilger, New York.
14. Sanderson, T., Ume, C., and Jarzynski, J., 1998, "Experimental and Numerical Results for Intensity Modulated Laser Ultrasonic," J. Acoust. Soc. Am., 104(4), Oct, pp. 2207-2212.