Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 83-94

  Zahn, Bret A ^a  

^a ChipPAC Incorporated   (United States)

Author keywords

Accelerated temperature cycling; Board level reliability; Finite element modeling; Life prediction equations; Microelectronic packages; Solder fatigue

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MICROELECTRONIC PROCESSING; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MODELS; SOLDERING;

EUTECTIC SOLDER MATERIALS; LIFE PREDICTION EQUATIONS; MICROELECTRONIC PACKAGE STRUCTURES; SOLDER JOINT FATIGUE LIFE;

ELECTRONIC EQUIPMENT TESTING;

EID: 0038351733     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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