Flip chips and acoustic micro imaging: An overview of past applications, present status, and roadmap for the future

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1539-1543

  Semmens, Janet E ^a  

^a Sonoscan Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 16344369223     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00160-8     Document Type: Article

References (4)

1. S. Canumalla, "Resolution of Broadband Transducers in Acoustic Microscopy of Encapsulated ICs - Transducer Selection.," IEEE Transactions on Components and Packaging Technology, Vol.22, No. 4, December 1999.
2. David Lin, Hong-Quan Jiang, Erik, Jung, Elke Zakel, Herbert Reichl, "Non-Destructive Investigation of Flip Chip Underfill - A Comparison Between Acoustoand Infrared (IR) Microscopy", Proceedings of the Area Array Packaging Technologies, Nov. 13 - 15, 1995, Berlin, Germany
3. Canumalla, S., and Oravecz, M. G., 1997, "Nondestructive Elastic Property Characterization of IC Encapsulants," ASME Symposium on Applications of Fracture Mechanics to Electronic Packaging AMD-222/EP-20, November 1997.
4. Karl-Friedrich Becker, Janet Semmens, Frank Ansorge, R. Aschenbrenner, Herbert Reichl, "Qualification of Underfill Materials for Flip Chip Assemblies", Proceedings of the International Acoustic Micro Imaging Symposium (IAMIS), Feb. 26 - 27, 1998, Anaheim, CA.