Strain energy density criterion for reliability life prediction of solder joints in electronic packaging

Journal of Electronic Packaging

Volumn 126, Issue 3, 2004, Pages 398-405

  Guven, I ^a   Kradinov, V ^a   Tor, J L ^a   Madenci, E ^a  

^a University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; FATIGUE OF MATERIALS; RELIABILITY; SOLDERED JOINTS; STRAIN; STRESS ANALYSIS; THERMAL CYCLING;

FAILURE PREDICTION; MATERIAL SYSTEM; STRAIN ENERGY DENSITY; THERMAL FATIGUE;

ELECTRONICS PACKAGING;

EID: 12344257885     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1773855     Document Type: Article

References (12)

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