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Journal of Electronic Materials

Volumn 39, Issue 1, 2010, Pages 124-131

Growth of intermetallic compounds in thermosonic copper wire bonding on aluminum metallization

(4) Xu, Hui a Liu, Changqing a Silberschmidt, Vadim V a Chen, Zhong b

a LOUGHBOROUGH UNIVERSITY (United Kingdom)

b NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

Author keywords

Bonding mechanism; Copper wire bonding; Growth kinetics; Interfacial analysis; Intermetallic compounds

Indexed keywords

BONDING MECHANISM; COPPER WIRE BONDING; COPPER WIRES; INTERFACIAL ANALYSIS; INTERMETALLIC COMPOUNDS;

ACTIVATION ENERGY; BIOACTIVITY; COPPER; ELECTRON DIFFRACTION; GROWTH KINETICS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; THERMAL AGING; TRANSMISSION ELECTRON MICROSCOPY; WIRE;

ALUMINUM;

EID: 74449091528 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0951-8 Document Type: Article

Times cited : (78)

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