Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging

Materials Science and Engineering: A

Volumn 447, Issue 1-2, 2007, Pages 111-118

  Ji, Hongjun ^a   Li, Mingyu ^a   Wang, Chunqing ^a   Bang, Han Sur ^b   Bang, Hee Seon ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Chosun University   (South Korea)

Author keywords

Cracks; Intermetallic compounds; Kirkendall voids; Thermal reliability; Ultrasonic wedge bonding

Indexed keywords

ALUMINUM; BONDING; CRACKS; GOLD; INTERFACES (MATERIALS); THERMOANALYSIS; ULTRASONIC APPLICATIONS;

INTERFACIAL INTERMETALLIC COMPOUNDS; KIRKENDALL VOIDS; THERMAL AGING; THERMAL RELIABILITY; ULTRASONIC WEDGE BONDING;

INTERMETALLICS;

ALUMINUM; BONDING; CRACKS; GOLD; INTERFACES (MATERIALS); INTERMETALLICS; THERMOANALYSIS; ULTRASONIC APPLICATIONS;

EID: 33846192900     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.10.105     Document Type: Article

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