Critical study of thermosonic copper ball bonding

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 339-345

  Srikanth, N ^a   Murali, S ^a   Wong, Y M ^a   Vath III, Charles J ^a  

^a ASM Technology Singapore Pte Ltd   (Singapore)

Author keywords

Copper; Shear strength; Ultrasonics; Wire bonding

Indexed keywords

SUBDIVIDED GRAINS; THERMOSONIC COPPER BALL BONDING; ULTRASONIC ENERGY;

CHEMICAL BONDS; GOLD; MICROHARDNESS; SHEAR STRENGTH; STRAIN HARDENING; ULTRASONICS; WIRE;

COPPER;

EID: 4344696821     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.116     Document Type: Article

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