TEM microstructural analysis of As-Bonded Al-Au wire-bonds

Journal of Materials Science

Volumn 42, Issue 7, 2007, Pages 2334-2346

  Karpel, Adi ^a   Gur, Giyora ^b   Atzmon, Ziv ^b   Kaplan, Wayne D ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b Kulicke and Soffa Bonding Tools   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ENERGY DISPERSIVE SPECTROSCOPY; FOCUSED ION BEAMS; INTERFACES (MATERIALS); MICROSTRUCTURE; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY; WIRE;

BONDING TEMPERATURE; INTERFACE MORPHOLOGY; MICROSTRUCTURAL ANALYSIS; WIRE BONDS;

BOND STRENGTH (MATERIALS);

EID: 33947600574     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-007-1592-z     Document Type: Article

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