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Volumn 50, Issue 12, 2007, Pages
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Manufacturing integration considerations of through-silicon via etching
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Author keywords
[No Author keywords available]
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Indexed keywords
DIGITAL INTEGRATED CIRCUITS;
MEMS;
MULTILAYERS;
PLASMA ETCHING;
SIZE DISTRIBUTION;
MANUFACTURING INTEGRATION;
SILICON ETCHING;
THROUGH SILICON VIAS (TSV);
SILICON;
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EID: 38049184163
PISSN: 0038111X
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (14)
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References (0)
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