Ultra-thin chips and related applications, a new paradigm in silicon technology

ESSCIRC 2009 - Proceedings of the 35th European Solid-State Circuits Conference

Volumn , Issue , 2009, Pages 28-35

  Burghartz, Joachim N ^a   Appel, Wolfgang ^a   Harendt, Christine ^a   Rempp, Horst ^a   Richter, Harald ^a   Zimmermann, Martin ^a  

^a Institut fur Mikroelektronik Stuttgart   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE INTEGRATION; ENABLING TECHNOLOGIES; NEW APPLICATIONS; SILICON TECHNOLOGIES; THIN WAFERS; ULTRA-THIN CHIPS;

SILICON WAFERS; TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 72849110691     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSCIRC.2009.5326011     Document Type: Conference Paper

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