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Journal of Applied Physics

Volumn 98, Issue 1, 2005, Pages

Study of electromigration in thin tin film using edge displacement method

(3) Yu, H C a Liu, S H a Chen, Chih a

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOM FLUX; EDGE DISPLACEMENT; INTERMEDIATE COMPOUNDS; THRESHOLD CURRENT DENSITY;

ACTIVATION ENERGY; CRYSTAL WHISKERS; CURRENT DENSITY; ELECTROMIGRATION; METALLIZING; STRESSES; TIN;

THIN FILMS;

EID: 22944441624 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.1954871 Document Type: Article

Times cited : (17)

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