Electroless deposition and electrical resistivity of sub-100 nm Cu films on SAMs: State of the art

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2466-2470

  Glickman, E ^a   Inberg, A ^a   Fishelson, N ^a   Shaham Diamand, Y ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

Adhesion; Cu films; Diffusion barriers; Electroless deposition; NH2 group Au nano particles; Resistivity; Self assembling monolayers; Silanization; Surface activation

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; MONOLAYERS;

AMINO-SILANE; AU MONODISPERSED NANO-PARTICLES; SELF-ASSEMBLING MONOLAYERSSELF-ASSEMBLING MONOLAYERSSELF-ASSEMBLING MONOLAYERS;

ELECTROLESS PLATING;

EID: 34548864088     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.032     Document Type: Article

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