60 GHz single-chip front-end MMICs and systems for multi-Gb/s wireless communication

IEEE Journal of Solid-State Circuits

Volumn 42, Issue 5, 2007, Pages 1143-1156

  Gunnarsson, Sten E ^a,b   Kärnfelt, Camilla ^a,b   Zirath, Herbert ^a,b,c   Kozhuharov, Rumen ^b   Kuylenstierna, Dan ^a,b   Fager, Christian ^a,b   Ferndahl, Mattias ^a,b   Hansson, Bertil ^b   Alping, Arne ^a,c   Hallbjörner, Paul ^c,d  

^a IEEE   (Sweden)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c Ericsson Microwave Systems AB   (Sweden)

^d SP TECHNICAL RESEARCH INSTITUTE OF SWEDEN   (Sweden)

Author keywords

60 GHz; Flip chip; GaAs; Highly integrated; Image rejection; MHEMT; MMIC; Multi functional; Packaging; Receiver; RFIC; RX; Single chip; Transmitter; TX; V band

Indexed keywords

CENTER FREQUENCY; IMAGE REJECTION; V-BAND; WIRE BONDING; WIRELESS SIGNALS;

ELECTRIC POWER UTILIZATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HIGH ELECTRON MOBILITY TRANSISTORS; SEMICONDUCTING GALLIUM ARSENIDE; SIGNAL RECEIVERS; TRANSMITTERS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 34247331832     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2007.894824     Document Type: Conference Paper

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