-
1
-
-
0003479594
-
-
Addison-Wesley, New York
-
Bakoglu, H. B., Circuits, Interconnections, and Packaging for VLSI. Addison-Wesley, New York, 1990.
-
(1990)
Circuits, Interconnections, and Packaging for VLSI.
-
-
Bakoglu, H.B.1
-
2
-
-
0013293788
-
The skin effect: II. The skin effect at high frequencies
-
Casimir, H. B. G., and Ubbink, J., The skin effect: II. The skin effect at high frequencies. Philips Tech. Rev. 28, 300-315 (1967).
-
(1967)
Philips Tech. Rev.
, vol.28
, pp. 300-315
-
-
Casimir, H.B.G.1
Ubbink, J.2
-
3
-
-
0039157191
-
Reduction of skin effect losses by the use of laminated conductors
-
Clogston, A. M., Reduction of skin effect losses by the use of laminated conductors. Bell Syst. Tech. J. 30, 491-529 (1951).
-
(1951)
Bell Syst. Tech. J.
, vol.30
, pp. 491-529
-
-
Clogston, A.M.1
-
4
-
-
0027353426
-
Recent research trends and issues in photonic switching technologies
-
Egawa, T., Yukimatsu, K., and Yamasaki, K., Recent research trends and issues in photonic switching technologies. NTT Rev. 5 (1), 30-37, (1993).
-
(1993)
NTT Rev.
, vol.5
, Issue.1
, pp. 30-37
-
-
Egawa, T.1
Yukimatsu, K.2
Yamasaki, K.3
-
5
-
-
0004167597
-
-
McGraw-Hill, New York
-
Fink, D. G., and Christiansen, D. (Eds.), Electronics Engineers' Handbook, 3rd ed. McGraw-Hill, New York, 1989.
-
(1989)
Electronics Engineers' Handbook, 3rd Ed.
-
-
Fink, D.G.1
Christiansen, D.2
-
6
-
-
0030113510
-
Extending the range of copper for fiber channel interconnects
-
Apr.
-
Foster, C., and Van Duesen, H., Extending the range of copper for fiber channel interconnects. Electronic Packaging and Production, 59-64 (Apr. 1996).
-
(1996)
Electronic Packaging and Production
, pp. 59-64
-
-
Foster, C.1
Van Duesen, H.2
-
7
-
-
0029290641
-
GaAs MQW modulators integrated with silicon CMOS
-
Goossen, K. W., Walker, J. A., D'Asaro, L. A., Hui, S. P., Tseng, B., Leibenguth, R., Kossives, D., Bacon, D. D., Dahringer, D., Chirovsky, L. M. F., Lentine, A. L., and Miller, D. A. B., GaAs MQW modulators integrated with silicon CMOS. IEEE Phot. Tech. Lett. 7, 360-362 (1995).
-
(1995)
IEEE Phot. Tech. Lett.
, vol.7
, pp. 360-362
-
-
Goossen, K.W.1
Walker, J.A.2
D'Asaro, L.A.3
Hui, S.P.4
Tseng, B.5
Leibenguth, R.6
Kossives, D.7
Bacon, D.D.8
Dahringer, D.9
Chirovsky, L.M.F.10
Lentine, A.L.11
Miller, D.A.B.12
-
8
-
-
0026677921
-
High-frequency performance of GE high-density interconnect modules
-
IEEE, New York
-
Haller, T. R., Whitmore, B. S., Zabinski, P. J., and Gilbert, B. K., High-frequency performance of GE high-density interconnect modules. Proc. 42nd Electronic Components and Technology Conference. IEEE, New York, 1992, pp. 136-143.
-
(1992)
Proc. 42nd Electronic Components and Technology Conference
, pp. 136-143
-
-
Haller, T.R.1
Whitmore, B.S.2
Zabinski, P.J.3
Gilbert, B.K.4
-
9
-
-
0026817698
-
A review of the skin effect as applied to thin film interconnections
-
Hwang, L., and Turlik, I., A review of the skin effect as applied to thin film interconnections. IEEE Trans. Components Hybrids Manufacturing Tech. 15, 43-55, (1992).
-
(1992)
IEEE Trans. Components Hybrids Manufacturing Tech.
, vol.15
, pp. 43-55
-
-
Hwang, L.1
Turlik, I.2
-
10
-
-
85030052703
-
-
ITT Pomona Electronics
-
ITT Pomona Electronics.
-
-
-
-
11
-
-
0029236305
-
Performance of TI high density interconnect for 1 GHz digital MCM applications
-
IEEE, New York
-
Kacines, J. J., Schaefer, T. M., and Gilbert, B. K., Performance of TI high density interconnect for 1 GHz digital MCM applications. Proc. 45th Electronic Components and Technology Conference. IEEE, New York, 1995.
-
(1995)
Proc. 45th Electronic Components and Technology Conference
-
-
Kacines, J.J.1
Schaefer, T.M.2
Gilbert, B.K.3
-
12
-
-
0029409492
-
3D integration of MQW modulators over active submicron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuit
-
Krishnamoorthy, A. V., Lentine, A. L., Goossen, K. W., Walker, J. A., Woodward, T. K., Ford, J. E., Aplin, G. F., D'Asaro, L. A., Hui, S. P., Tseng, B., Leibenguth, R., Kossives, D., Dahringer, D., Chirovsky, L. M. F., and Miller, D. A. B., 3D integration of MQW modulators over active submicron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuit. IEEE Phot. Tech. Lett. 7, 1288-1290 (1995).
-
(1995)
IEEE Phot. Tech. Lett.
, vol.7
, pp. 1288-1290
-
-
Krishnamoorthy, A.V.1
Lentine, A.L.2
Goossen, K.W.3
Walker, J.A.4
Woodward, T.K.5
Ford, J.E.6
Aplin, G.F.7
D'Asaro, L.A.8
Hui, S.P.9
Tseng, B.10
Leibenguth, R.11
Kossives, D.12
Dahringer, D.13
Chirovsky, L.M.F.14
Miller, D.A.B.15
-
14
-
-
85030053737
-
Demonstration of an experimental single chip optoelectronic switching system
-
Postdeadline paper PD2.5, IEEE Lasers and Electro-Optics Society. IEEE, Piscataway
-
Lentine, A. L., Novotny, R. A., Reiley, D. J., Morrison, R. L., Sasian, J. M., Beckman, M. G., Buchholz, D. B., Hinterlong, S. J., Cloonan, T. J., Richards, G. W., and McCormick, F. B., Demonstration of an experimental single chip optoelectronic switching system. Postdeadline paper PD2.5, 8th Annual Meeting, IEEE Lasers and Electro-Optics Society. IEEE, Piscataway, 1995.
-
(1995)
8th Annual Meeting
-
-
Lentine, A.L.1
Novotny, R.A.2
Reiley, D.J.3
Morrison, R.L.4
Sasian, J.M.5
Beckman, M.G.6
Buchholz, D.B.7
Hinterlong, S.J.8
Cloonan, T.J.9
Richards, G.W.10
McCormick, F.B.11
-
15
-
-
0024664514
-
Electrical resistance as a limiting factor for high-performance computer packaging
-
May
-
Masaki, A., Electrical resistance as a limiting factor for high-performance computer packaging. IEEE Circuits Devices Magazine 22-26 (May 1989).
-
(1989)
IEEE Circuits Devices Magazine
, pp. 22-26
-
-
Masaki, A.1
-
16
-
-
0028404111
-
Five-stage free-space optical switching network with field-effect transistor self-electro-optic-effect-device smart-pixel arrays
-
McCormick, F. B., Cloonan, T. J., Lentine, A. L., Sasian, J. M., Morrison, R. L., Beckman, M. G., Walker, S. L., Wojcik, M. J., Hinterlong, S. J., Crisci, R. J., Novotny, R. A., and Hinton, H. S., Five-stage free-space optical switching network with field-effect transistor self-electro-optic-effect-device smart-pixel arrays. Appl. Opt. 33, 1601-1618 (1994).
-
(1994)
Appl. Opt.
, vol.33
, pp. 1601-1618
-
-
McCormick, F.B.1
Cloonan, T.J.2
Lentine, A.L.3
Sasian, J.M.4
Morrison, R.L.5
Beckman, M.G.6
Walker, S.L.7
Wojcik, M.J.8
Hinterlong, S.J.9
Crisci, R.J.10
Novotny, R.A.11
Hinton, H.S.12
-
17
-
-
0005686558
-
Dense optical interconnects for silicon electronics
-
A. Consortini, (Ed.), Academic Press, San Diego
-
Miller, D. A. B., Dense optical interconnects for silicon electronics. In A. Consortini, (Ed.), Trends in Optics Research, Development and Applications. Academic Press, San Diego, 1996, pp. 207-222.
-
(1996)
Trends in Optics Research, Development and Applications
, pp. 207-222
-
-
Miller, D.A.B.1
-
18
-
-
0029505680
-
Hybrid SEED massively parallel optical interconnections for silicon ICs
-
IEEE Computer Society Press, Los Alamitos, California
-
Miller, D. A. B., Hybrid SEED massively parallel optical interconnections for silicon ICs. Proc. 2nd Int. Conf. Massively Parallel Processing Using Optical Interconnections (MPPOI'95). IEEE Computer Society Press, Los Alamitos, California, 1995, pp. 2-7.
-
(1995)
Proc. 2nd Int. Conf. Massively Parallel Processing Using Optical Interconnections (MPPOI'95)
, pp. 2-7
-
-
Miller, D.A.B.1
-
19
-
-
84975575716
-
Optics for low-energy communication inside digital processors: Quantum detectors, sources, and modulators as efficient impedance converters
-
Miller, D. A. B., Optics for low-energy communication inside digital processors: Quantum detectors, sources, and modulators as efficient impedance converters. Optics Lett. 14, 146-148 (1989).
-
(1989)
Optics Lett.
, vol.14
, pp. 146-148
-
-
Miller, D.A.B.1
-
21
-
-
0039157190
-
-
Ph.D. thesis, Stanford University, Stanford, CA
-
Ozaktas, H. M., A physical approach to communication limits in computation. Ph.D. thesis, Stanford University, Stanford, CA, 1991.
-
(1991)
A Physical Approach to Communication Limits in Computation
-
-
Ozaktas, H.M.1
-
22
-
-
0039157188
-
The limitations of interconnections in providing communication between an array of points
-
S. K. Tewksbury (Ed.). Plenum Press, New York
-
Ozaktas, H. M., and Goodman, J. W., The limitations of interconnections in providing communication between an array of points. In S. K. Tewksbury (Ed.). Frontiers in Computing Systems Research, Vol. 2 Plenum Press, New York, 1991, pp. 61-130.
-
(1991)
Frontiers in Computing Systems Research
, vol.2
, pp. 61-130
-
-
Ozaktas, H.M.1
Goodman, J.W.2
-
23
-
-
0004040521
-
-
Prentice-Hall, Carmel, Indiana
-
Reference Data for Engineers: Radio, Electronics, Computer, and Communications, 8th ed. Prentice-Hall, Carmel, Indiana, 1993.
-
(1993)
Reference Data for Engineers: Radio, Electronics, Computer, and Communications, 8th Ed.
-
-
-
25
-
-
0029406512
-
Transmission of eight 20-Gb/s channels over 232 km of conventionalsingle-mode fiber
-
Tkach, R. W., Derosier, R. M., Gnauck, A. H., Vengsarkar, A. M., Peckham, D. W., Zyskind J. L., Sulhoff, J. W., and Chraplyvy, A. R., Transmission of eight 20-Gb/s channels over 232 km of conventionalsingle-mode fiber. IEEE Phot. Tech. Lett. 7, 1369-1371 (1995).
-
(1995)
IEEE Phot. Tech. Lett.
, vol.7
, pp. 1369-1371
-
-
Tkach, R.W.1
Derosier, R.M.2
Gnauck, A.H.3
Vengsarkar, A.M.4
Peckham, D.W.5
Zyskind, J.L.6
Sulhoff, J.W.7
Chraplyvy, A.R.8
-
26
-
-
0029247093
-
320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM
-
Yamanaka, N., Endo, K., Genda, K., Fukuda, H., Kishimoto, T., and Sasaki, S., 320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM. IEEE Trans. Components Packaging Manufacturing Tech. B 18, 83-91 (1995).
-
(1995)
IEEE Trans. Components Packaging Manufacturing Tech. B
, vol.18
, pp. 83-91
-
-
Yamanaka, N.1
Endo, K.2
Genda, K.3
Fukuda, H.4
Kishimoto, T.5
Sasaki, S.6
-
27
-
-
84937740897
-
Transient analysis of coaxial cables considering skin effect
-
Wigington, R. L., and Nahman, N. S., Transient analysis of coaxial cables considering skin effect. Proc. IRE 45, 166-174 (1957).
-
(1957)
Proc. IRE
, vol.45
, pp. 166-174
-
-
Wigington, R.L.1
Nahman, N.S.2
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