Characteristics of the high speed shear test for Sn-3.0wt.%Ag-0.5wt.%Cu Solder ball joints

Journal of Korean Institute of Metals and Materials

Volumn 47, Issue 9, 2009, Pages 580-585

  Lee, Young Gon ^a   Lee, Hee Yul ^a   Moon, Jeong Tak ^b   Park, Jai Hyun ^c   Han, Shin Sik ^d   Jung, Jae Pil ^a  

^a University of Seoul   (South Korea)

^b MK Electron Co Ltd   (South Korea)

^c Research Institute of Industrial Science and Technology (RIST)   (South Korea)

^d Korea Polytechnic   (South Korea)

Author keywords

High speed shear test; Shear strength; Shearing speed; Shearing tip height; Solder ball

Indexed keywords

EID: 70949091291     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

1. Y. L. Huang and K. L. Lin, J. Mater. Res. 23, 1057 (2008).
2. S. M. L. Nai, J. Wei, and M. Gupta, Journal of Alloy and Compound (article in press) (2008).
3. P. Limaye, B. Vandevelde, R. Labie, D. Vandepitte, and B. Verlinden, Advanced packaging 31, 51 (2008).
4. J. W. Kim and S. B. Jung, Microelectronic Engineering 82, 554 (2005).
5. C.-L. Yeh and Y.-S. Lai, Microelectronics and Reliability 46, 885 (2006).
6. Y.-H. Liu, C.-M. Chuang, and K.-L. Lin, J. Mater. Res. 19, 2471 (2004).
7. E. H. Wong, C. S. Selvanayagam, S. K. W. Seah, W D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, D. R. Frear, M. Leoni, Y.-S. Lai, and C.-L. Yeh, Materials Letters 62, 3031 (2008).
8. JESD22-B117A, JEDEC Solid State Technology Association (2006).
9. S. F. Dirnfield and J. J. Ramon, Weld. Jour. Res. Supplement 69, 373 (1990).
10. C.-C. Chi and T.-H. Chuang, Journal of Electronic Materials 35, 471 (2006).
11. Y.-C. Liu, W.-H. Lin, H.-J. Lin, and T.-H. Chuang, Journal of Electronic Materials 35, 147 (2006).
12. J. Y. H. Chia, B. Cotterell, and T. C. Chai, Mater. Sci. Eng. A 417, 259 (2006).
13. F. Song, S. W. R. Lee, K. Newman, B. Sykes, and S. Clark, Proc. 57th Electronic Components and Technology Conference, p. 1504, IEEE, Reno, USA (2007).
14. F. Song, S. W R. Lee, K. Newman, B. Sykes, and S. Clark, Proc. 57th Electronic Components and Technology Conference, p. 364, IEEE, Reno, USA (2007).
15. S. W. R. Lee and X. Huang, Solder. Surf. Mount Technol. 14, 15 (2002).
16. J. W. Kim, J. H. Moon, C. C. S, and S. B. Jung, J. Kor. Inst. Met. & Mater. 44, 199 (2006).
17. A. Choubey, H. Yu, M. Osterman, M. Pecht, F. Yun, L. Yonghong, and X. Ming, Journal of Electronic Materials 37, 1130 (2008).