Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads

Journal of Electronic Materials

Volumn 35, Issue 3, 2006, Pages 471-478

  Chi, Chih Chien ^a   Chuang, Tung Han ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Ag and Au Ni surface finishes; Aging; Intermetallic compounds; Reflow; Sn 3.5Ag BGA

Indexed keywords

BALL GRID ARRAY; INTERMETALLIC REACTIONS; LIQUID SOLDER; PAD INTERFACES; REFLOW PROCESS;

AGING OF MATERIALS; DEGRADATION; DIFFUSION; DISPERSIONS; ELECTRONICS PACKAGING; SHEAR STRENGTH; SOLDERED JOINTS; THIN FILMS;

INTERMETALLICS;

EID: 33645568425     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02690534     Document Type: Article

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