Adhesion enhancement of electroless-deposited cu on flexible polyimide substrate treated by o2 and n2 / h2 inductively coupled plasmas

Journal of the Electrochemical Society

Volumn 156, Issue 12, 2009, Pages

  Kim, H W ^a   Kim, J H ^a   Kim, D J ^a   Lee, N E ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION ENHANCEMENT; ADHESION PROPERTIES; ADHESION STRENGTHS; COMBINED TREATMENT; ELECTROLESS; FLEXIBLE POLYIMIDE SUBSTRATE; PEEL STRENGTH; PEEL TESTS; PI SYSTEMS; PLASMA TREATMENT; SUBSTRATE BIAS; SURFACE MORPHOLOGICAL ROUGHENING;

AMIDES; AMINES; BOND STRENGTH (MATERIALS); CHEMICAL MODIFICATION; FUNCTIONAL GROUPS; INDUCTIVELY COUPLED PLASMA; INORGANIC COATINGS; PLASMA APPLICATIONS; POLYIMIDES;

ADHESION;

EID: 70350728586     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3231849     Document Type: Article

References (25)

1. Polyimides: Synthesis, Characterization and Applications, K. L. Mittal, Editor, Plenum, New York (1984).
2. Polyimides-Fundamentals and Applications, M. Crosh, and, K. Mittal, Editors, Marcel Dekker, New York (1994).
3. S. H. Kim, S. W. Na, N. -E. Lee, Y. W. Nam, and Y. H. Kim, Surf. Coat. Technol. 0257-8972, 200, 2072 (2005). 10.1016/j.surfcoat.2005.05.021 (Pubitemid 41819145)
4. S. H. Kim, S. H. Cho, N. -E. Lee, H. M. Kim, Y. W. Nam, and Y. H. Kim, Surf. Coat. Technol. 0257-8972, 193, 101 (2005). 10.1016/j.surfcoat.2004.08.130 (Pubitemid 40251962)
5. J. H. Kim, Y. G. Seol, and N. -E. Lee, J. Korean Phys. Soc. 0374-4884, 51, 187 (2007). 10.3938/jkps.51.187
6. D. Bhusari, H. Hayden, R. Tanikella, S. A. B. Allen, and P. A. Kohl, J. Electrochem. Soc. 0013-4651, 152, F162 (2005). 10.1149/1.2006587 (Pubitemid 41549499)
7. J. H. Kim, H. W. Kim, S. M. Park, and N. -E. Lee, J. Korean Phys. Soc. 0374-4884, 52, 318 (2008). 10.3938/jkps.52.318
8. J. S. Eom and S. H. Kim, Thin Solid Films 0040-6090, 516, 4530 (2008). 10.1016/j.tsf.2008.01.022
9. S. C. Park, S. S. Yoon, and J. D. Nam, Thin Solid Films 0040-6090, 516, 3028 (2008). 10.1016/j.tsf.2007.11.113
10. Y. Takagi, Y. Gunjo, H. Toyoda, and H. Sugai, Vacuum 0042-207X, 83, 501 (2008). 10.1016/j.vacuum.2008.04.049
11. C. S. Wong, H. P. Lem, B. T. Goh, and C. W. Wong, Jpn. J. Appl. Phys. 0021-4922, 48, 036501 (2009). 10.1143/JJAP.48.036501
12. R. K. Y. Fu, I. T. L. Cheung, Y. F. Mei, C. H. Shek, G. G. Siu, P. K. Chu, W. M. Yang, Y. X. Leng, Y. X. Huang, X. B. Tian, Nucl. Instrum. Methods Phys. Res. B 0168-583X, 237, 417 (2005). 10.1016/j.nimb.2005.05.029 (Pubitemid 41108265)
13. R. W. Paynter, Surf. Interface Anal. 0142-2421, 26, 674 (1998). 10.1002/(SICI)1096-9918(199808)26:9<674::AID-SIA414>3.0.CO;2-5
14. S. Pimanpang, P. -I. Wang, G. -C. Wang, and T. -M. Lu, Appl. Surf. Sci. 0169-4332, 252, 3532 (2006). 10.1016/j.apsusc.2005.05.049 (Pubitemid 43245648)
15. M. Froment, J. Electrochem. Soc. 0013-4651, 142, 3373 (1995). 10.1149/1.2049989
16. E. Natividad, E. Lataste, M. Lahaye, J. M. Heintz, and J. F. Silvain, Surf. Sci. 0039-6028, 557, 129 (2004). 10.1016/j.susc.2004.03.026
17. T. Osaka, H. Takematsu, and K. Nihei, J. Electrochem. Soc. 0013-4651, 127, 1021 (1980). 10.1149/1.2129810
18. R. L. Cohen and K. W. West, J. Electrochem. Soc. 0013-4651, 120, 502 (1973). 10.1149/1.2403486
19. D. Nicolas-Debarnot, M. Pascu, C. Vasile, and F. Poncin-Epaillard, Surf. Coat. Technol. 0257-8972, 200, 4257 (2006). 10.1016/j.surfcoat.2005.01.095 (Pubitemid 43335992)
20. R. Haight, R. C. White, B. D. Silverman, and P. S. Ho, J. Vac. Sci. Technol. A 0734-2101, 6, 2188 (1988). 10.1116/1.575010
21. A. M. Ektessabi and S. Hakamata, Thin Solid Films 0040-6090, 377-378, 621 (2000). 10.1016/S0040-6090(00)01444-9 (Pubitemid 32035282)
22. C. H. Yang, S. C. Lee, J. M. Wu, and T. C. Lin, Appl. Surf. Sci. 0169-4332, 252, 1818 (2005). 10.1016/j.apsusc.2005.03.182
23. Y. Nakamura, Y. Suzuki, and Y. Watanabe, Thin Solid Films 0040-6090, 290-291, 367 (1996). 10.1016/S0040-6090(96)09017-7 (Pubitemid 126391119)
24. M. Charbonnier, M. Alami, and M. Romand, J. Electrochem. Soc. 0013-4651, 143, 472 (1996). 10.1149/1.1836467
25. Y. Zhang, K. L. Tan, G. H. Yang, E. T. Kang, and K. G. Neoh, J. Electrochem. Soc. 0013-4651, 148, C574 (2001). 10.1149/1.1387237 (Pubitemid 33693695)