|
|
Volumn 83, Issue 3, 2008, Pages 501-505
|
|
Rapid treatment of polyimide film surfaces using high-density microwave plasma for enhancement of Cu layer adhesion
|
|
Author keywords
Copper adhesion; High density plasma; Hydrophilicity; Microwave plasma; Polyimide film; Surface treatment
|
|
Indexed keywords
ADHESION;
ATOMIC SPECTROSCOPY;
CONTACT ANGLE;
COPPER ALLOYS;
MICROWAVES;
MOLECULAR ORBITALS;
MOLECULAR SPECTROSCOPY;
PHOTOELECTRON SPECTROSCOPY;
PHOTORESISTS;
PLASMA APPLICATIONS;
PLASMAS;
POLYMERS;
SPUTTERING;
SURFACE ROUGHNESS;
SURFACE TREATMENT;
X RAY PHOTOELECTRON SPECTROSCOPY;
AR PLASMAS;
ATOMIC FORCE MICROPROBE;
CONTACT ANGLES;
COPPER ADHESION;
CU LAYERS;
DOUBLE BONDS;
HIGH-DENSITY MICROWAVE PLASMAS;
HIGH-DENSITY PLASMA;
HYDROPHILICITY;
LAYER ADHESION;
MICROWAVE PLASMA;
PEEL STRENGTH;
PLASMA TREATMENTS;
POLY-IMIDE FILMS;
POLYIMIDE;
POLYIMIDE FILM;
SPUTTER-DEPOSITED COPPER;
COPPER;
|
|
EID: 52949114560
PISSN: 0042207X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.vacuum.2008.04.049 Document Type: Article |
|
Times cited : (31)
|
|
References (5)
|
