Electroless plating of copper on polyimide film modified by 50 hz plasma graft polymerization with 1-vinylimidazole

Japanese Journal of Applied Physics

Volumn 48, Issue 3, 2009, Pages 036501-

  Wong, Chiow San ^a   Lem, Hon Pong ^a,b   Goh, Boon Tong ^a,b   Wong, Cin Wie ^a,b  

^a UNIVERSITY OF MALAYA   (Malaysia)

^b nanoFLEX Sdn Bhd E308   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION PROPERTIES; ADHESION STRENGTHS; AFM; AIR SHOWS; FLEXIBLE PRINTED CIRCUIT; IN-VACUUM; NOVEL PROCESS; PI FILM; PLASMA GRAFT POLYMERIZATION; PLASMA POWER; POLYIMIDE FILM; POST THERMAL TREATMENT; PRE-SELECTED; PROOF OF CONCEPT; SEM; TIME WINDOWS; VINYLIMIDAZOLE;

ADHESION; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BOND STRENGTH (MATERIALS); ELECTRONIC EQUIPMENT MANUFACTURE; GRAFTING (CHEMICAL); HEAT TREATMENT; INORGANIC COATINGS; METALLIZING; PLASMAS; POLYIMIDES; POLYMERIZATION; PRINTED CIRCUITS; SCANNING ELECTRON MICROSCOPY; WINDOWS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER;

EID: 67650831709     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.48.036501     Document Type: Article

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