Statistical reliability analysis under process variation and aging effects

Proceedings - Design Automation Conference

Volumn , Issue , 2009, Pages 514-519

  Yinghai, Lu ^a   Li, Shang ^b   Hai, Zhou ^a,c   Hengliang, Zhu ^a   Fan, Yang ^a   Xuan, Zeng ^a  

^a FUDAN UNIVERSITY   (China)

^b UNIVERSITY OF COLORADO   (United States)

^c NORTHWESTERN UNIVERSITY   (United States)

Author keywords

NBTI; Process variations; Yield

Indexed keywords

AGING EFFECTS; CIRCUIT ELEMENTS; CIRCUIT LIFETIME; CIRCUIT PERFORMANCE; CIRCUIT RELIABILITY; CIRCUIT TIMING; ITERATIVE DESIGN; LIFETIME RELIABILITY; NANO-METER-SCALE; NBTI; NEGATIVE BIAS TEMPERATURE INSTABILITY; PROCESS VARIATION; PROCESS VARIATIONS; RELIABILITY DEGRADATION; RUNTIMES; SIGNIFICANT IMPACTS; STATISTICAL ANALYSIS; STATISTICAL RELIABILITY; WORK FOCUS; YIELD;

COMPUTER AIDED DESIGN; DIGITAL INTEGRATED CIRCUITS; ELECTRIC NETWORK ANALYSIS; FABRICATION; FIELD EFFECT TRANSISTORS; INTEGRATED CIRCUITS; NEGATIVE TEMPERATURE COEFFICIENT; QUALITY ASSURANCE; THERMAL EFFECTS; THERMODYNAMIC STABILITY; TIMING CIRCUITS;

RELIABILITY ANALYSIS;

EID: 70350724720     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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