A novel integrated thin film capacitor realized by a multilayer ceramic-electrode sandwich structure

Journal of the European Ceramic Society

Volumn 19, Issue 6-7, 1999, Pages 1413-1415

  Grossmann, Michael ^a   Slowak, Roland ^a   Hoffmann, Susanne ^a   John, Holger ^a   Waser, Rainer ^a  

^a NONE

Author keywords

BaTiO3 and titanates; Capacitors.; Films; Integration

Indexed keywords

CAPACITANCE; CERAMIC MATERIALS; ELECTRODES; MULTILAYERS; PERMITTIVITY; PLATINUM; SANDWICH STRUCTURES; SILICON WAFERS; SPUTTER DEPOSITION; STRONTIUM COMPOUNDS; SURFACE MOUNT TECHNOLOGY; THIN FILMS;

CHEMICAL SOLUTION DEPOSITION; INTEGRATED CAPACITOR PER CHIP AREA; INTEGRATED THIN FILM CAPACITOR; SANDWICH MULTILAYER STRUCTURE; TITANATES;

CAPACITORS;

EID: 0032682985     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0955-2219(98)00447-6     Document Type: Article

References (3)

1. Noma, A. and Ueda, D., Reliability study on BST capacitors for GaAs MMIC. Integrated Ferroelectrics, 1997, 15, 69-78.
2. Nagata, S., Ueda, T., Noma, A., Koizumi, H., Kanazawa, K., Ishida, H., Ueda, T., Tanaka, T., Ueda, D., Kazumura, M., Kano, G. and Paz de Araujo, C., A GaAs MMIC chip-set for mobile communcations using on-chip ferroelectric capacitors. IEEE ISSCC, 1993, pp. 172-173.
3. 3 thin layers by metalorganic chemical vapor deposition. Jpn. J Appl. Phys., 1997, 36, 5870-5873.