Residual stresses in multilayer ceramic capacitors: Measurement and computation

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 506-511

  Den Toonder, Jaap M J ^a   Rademaker, Christian W ^b   Hu, Ching Li ^c  

^a Phillps Research Laboratories   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c Phycomp Res and Devmt Dept   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; CERAMIC MATERIALS; COMPUTER SIMULATION; COOLING; CRACKS; ELASTIC MODULI; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INDENTATION; RESIDUAL STRESSES; SINTERING; STRESS ANALYSIS;

MICROINDENTATION; MULTILAYER CERAMIC CAPACITORS; STRESS MEASUREMENT;

CERAMIC CAPACITORS;

EID: 0346936444     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604151     Document Type: Article

References (12)

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