Nickel microneedles fabricated by sequential copper and nickel electroless plating and copper chemical wet etching

Sensors and Materials

Volumn 20, Issue 1, 2008, Pages 45-53

  Jung, Phill Gu ^a   Lee, Tae Won ^a   Oh, Dong Joon ^a   Hwang, Sung Jin ^a   Jung, Im Deok ^a   Lee, Sang Min ^a   Ko, Jong Soo ^a  

^a Pusan National University   (South Korea)

Author keywords

Chemical etching; Electroless plating; Microneedle

Indexed keywords

EID: 41149125384     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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