Wafer level chip scale packaging

Materials for Advanced Packaging

Volumn , Issue , 2009, Pages 547-600

  Töpper, Michael ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Adhesion; BCB; Bumping; Photo resists; PI; Polymers; Redistribution; Thin film; UBM; Wafer level packaging; WL CSP

Indexed keywords

EID: 70349697117     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-0-387-78219-5_16     Document Type: Chapter

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