Interfacial adhesion analysis of BCB/TiW/Cu/PbSn technology in waferlevel packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1843-1846

  Töpper, Michael ^a   Achen, Albert ^b   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

^b Dow Deutschland GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; CHEMICAL BONDS; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); MECHANICAL TESTING; MECHANICAL VARIABLES MEASUREMENT; METALLIZING; PASSIVATION; SPECTROSCOPIC ANALYSIS; SURFACE ROUGHNESS; THIN FILMS;

INTERFACIAL ADHESION; OPTICAL SPECTROSCOPY; SHEAR TEST; UNDER BUMP METALLIZATION; WAFERLEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 17744404194     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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