Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresists

Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007

Volumn , Issue , 2007, Pages

  Fischer, Thorsten ^a   Töpper, Michael ^a   Jürgensen, Nils ^a   Ehrmann, Oswin ^a   Wiemer, Maik ^b   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; INTEGRATED CIRCUITS; INTEGRATION; MOEMS; NETWORK COMPONENTS; PHOTORESISTS; TOPOGRAPHY;

3D STRUCTURE; CONFORMAL COATINGS; ON-WAFER; SI WAFER;

SILICON WAFERS;

EID: 84892802151     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. J. Klocke and J. Steeper; Proc. Pan Pacific Sympos. Maui, Hawaii, Febr. 2002
2. E. Boellaard, P.N. Pham, L.D.M. van den Brekel and G.J. Bertens; Meptec Report Quarter Two 2003, p. 29
3. C. Christensen, P. Kersten, S. Henke and S. Bouwstra; IEEE Transactions on Components, Packaging, and Manufacturing Technology A 19, 516, 1996