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Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1050-1059

Conformance of ECD wafer bumping to future demands on CSP, 3D integration, and MEMS

(4) Dietrich, L a Toepper, M a Ehrmann, O a Reichl, H a

a FRAUNHOFER IZM (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; ELECTROPLATING; LITHOGRAPHY; METALLIZING; MICROELECTROMECHANICAL DEVICES; PHOTOSENSITIVITY; THIN FILMS;

ELECTROCHEMICAL DEPOSITION (ECD); PHOTOSENSITIVE POLYMERS; SOLDER BUMPS; UNDER BUMP METALLIZATION (UBM);

ELECTRODEPOSITION;

EID: 33845570883 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2006.1645783 Document Type: Conference Paper

Times cited : (13)

References (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.