Printing solder paste in dry film - A low cost fine-pitch bumping technique

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 609-612

  Baumgartner, Tobias ^a   Manessis, Dionysios ^a   Töpper, Michael ^a   Hauck, Karin ^a   Ostmann, Andreas ^a   Reichl, Herbert ^a   Jorge, Pedro Gonçalo C T ^b   Yamada, Hidehiro ^b  

^a FRAUNHOFER IZM   (Germany)

^b DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CHIP SCALE PACKAGES; CHLORINE COMPOUNDS; CURING; DRYING; ELECTROCHEMISTRY; ELECTRONICS PACKAGING; ELECTROPLATING; METALLIZING; METALS; NICKEL; PHOTORESISTS; PRINTING; PRINTING PRESSES; PROCESS ENGINEERING; PROCESS MONITORING; SCREEN PRINTING; SOLDERING; TECHNOLOGY; WELDING;

BUMPING PROCESS; COMPLEX PROCESSING; COMPONENT SYSTEMS; LEAD FREE BUMPING; LOW COSTS; METAL SYSTEMS; METALLISATION; PACKAGING TECHNOLOGIES; PAD SIZES; PB-FREE; PHOTO RESIST; PRINTING SOLDER PASTE; PROCESS STEPS; SOLDER PASTES; TEST WAFERS; TOTAL COSTS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049133204     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469704     Document Type: Conference Paper

References (2)

1. K. Ruhmer, E. Laine, K. O'Donnell, J. Kostetsky, K. Hauck, D. Manessis, A. Ostmann, M. Topper, N. Juergensen "Alternative UBM for Lead Free Solder Bumping using C4NP" ECTC 2007 Reno, USA, June 2007
2. rd. International Symposium on Advanced Packaging Materials, March 1997, pp.115-116