UBM structures for lead free solder bumping using C4NP

16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007

Volumn , Issue , 2007, Pages 107-112

  Ruhmer, Klaus ^a   Laine, Eric ^a   Hauck, Karin ^b   Manessis, Dionysios ^b   Ostmann, Andreas ^b   Toepper, Michael ^b  

^a SUSS MicroTec Lithography GmbH   (United States)

^b FRAUNHOFER IZM   (Germany)

Author keywords

C4NP; ENIG; Lead free; Solder bumping; UBM

Indexed keywords

C4NP; ENIG; LEAD-FREE; SOLDER BUMPING; UBM;

CHIP SCALE PACKAGES; EXHIBITIONS; LABORATORIES; MICROELECTRONICS;

SOLDERING ALLOYS;

EID: 84875286976     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. "Microelectronic Packaging (Chapter 25)" M. Töpper, D. Tönnies in Semiconductor Manufacturing Handbook (M.h. Geng, Ed.), McGraw-Hill, 2005