Ultra-high density, thin core and low loss organic system-on-package (SOP) substrate technology for mobile applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 612-617

  Liu, Fuhan ^a   Sundaram, Venky ^a   Chan, Hunter ^a   Krishnan, Ganesh ^a   Shang, Jintang ^a   Dobrick, John ^b   Neill, Jack ^b   Baars, Dirk ^b   Kennedy, Scott ^b   Tummala, Rao ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Rogers Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER LINES; DIELECTRIC CONSTANTS; HIGH SPEED SYSTEMS; LEAD-FREE REFLOW; LOSS TANGENT; LOW DIELECTRIC CONSTANTS; LOW LOSS; LOW PROFILE; METAL LAYER; MICROVIAS; MOBILE APPLICATIONS; ORGANIC SYSTEMS; PORTABLE DEVICE; PROCESS DEVELOPMENT; PROCESS LIMITS; RELIABILITY CHARACTERIZATION; SUBSTRATE DESIGN; SUBSTRATE TECHNOLOGY; SYSTEM-IN-PACKAGE; SYSTEM-ON-PACKAGE; TEST VEHICLE; THIN DIELECTRIC FILM; THROUGH HOLE; ULTRA-HIGH; ULTRAHIGH DENSITY; WIRING DENSITY;

AUTOMOBILE PARTS AND EQUIPMENT; CELLULAR RADIO SYSTEMS; CERAMIC CAPACITORS; DIELECTRIC FILMS; DIELECTRIC WAVEGUIDES; GLASS FIBERS; METAL TESTING; PERMITTIVITY; STRUCTURAL METALS;

SUBSTRATES;

EID: 70349677359     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074076     Document Type: Conference Paper

References (4)

1. Seunghyun Hwang, Sung-Hwan Min, Madhavan Swaminathan, Venkatesan, Venkatakrishnan, Hunter Chan, Fuhan Liu, Venky Sundaram, Scott Kennedy and Dirk Baars, "Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics from 1 to 40GHz", Submitted to IEEE Transactions on Advanced Packaging, 2008.
2. Rao R. Tummala, Madhavan Swaminathan, Introduction to System-on-Package (SOP), McGraw-Hill (New York, 2008).
3. N. Kumbhat, M. Raine, G. Mehrotra, A. Choudhury, P. M. Raj, R. Zhang, K. S. Moon, V. Sundaram, G. Meyer-Berg, CP Wong, and Rao Tummala, "Highly-Reliable, 30μm Pitch Copper Interconnects using nano-ACF/NCF", ECTC 2009.
4. Scott Kennedy, Al Horn, and Greg Bull, Fuhan Liu, Hunter Chan, Venky Sundaram, and Rao Tummala, "An Overview of Material Options Suitable for Today's Commercial Millimeter Wave Designs", To be published in Circuitree, May 2009.