Reactive multilayer foils for MEMS wafer level packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1311-1316

  Qiu, Xiaotun ^a   Zhu, Jie ^b   Oiler, Jon ^b   Yu, Hongyu ^a,b  

^a AZ 85281   (United States)

^b ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION LAYER; AU-SN SOLDER; BONDING PROCESS; DOMINANT PRODUCT; HEAT OF REACTION; HERMETICITY; INTERMEDIATE LAYERS; ISOPROPANOL ALCOHOLS; LEAKAGE TESTS; LOCAL HEAT SOURCE; LOCALIZED HEATING; MULTILAYER FOILS; NUMERICAL SIMULATION; PARYLENE C; RAPID COOLING; ROOM TEMPERATURE BONDING; WAFER LEVEL PACKAGE; WAFER LEVEL PACKAGING; XRD MEASUREMENTS;

BONDING; COMPUTER SIMULATION; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; EXOTHERMIC REACTIONS; MEMS; MICROELECTROMECHANICAL DEVICES; MULTILAYERS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

WAFER BONDING;

EID: 70349678247     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074181     Document Type: Conference Paper

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