Highly conformal film growth by chemical vapor deposition. I. A conformal zone diagram based on kinetics

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 27, Issue 5, 2009, Pages 1235-1243

  Yanguas Gil, A ^a   Yang, Y ^a   Kumar, N ^a   Abelson, J R ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATE ANALYTICAL SOLUTIONS; CONFORMAL COVERAGE; CONFORMAL FILMS; CONFORMAL GROWTH; CONTINUITY EQUATIONS; DESORPTION RATE; EXPERIMENTAL CONDITIONS; EXPERIMENTAL DATA; GAS TRANSPORT; GASPHASE; KINETIC MODELS; PLANAR SUBSTRATE; PRECURSOR ADSORPTION; REACTION TEMPERATURE; SECONDARY REACTIONS; STEP COVERAGE; SUBSTRATE TEMPERATURE; SURFACE PROCESS; UNIFIED DESCRIPTION;

ADSORPTION; ASPECT RATIO; CHEMICAL VAPOR DEPOSITION; DESORPTION; INVERSE PROBLEMS; KINETIC THEORY; PRESSURE DROP; RATE CONSTANTS; SUBSTRATES; SURFACE REACTIONS; VAPORS;

FILM GROWTH;

EID: 70349114997     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.3207745     Document Type: Article

References (50)

1. S. M. Rossnagel, J. Vac. Sci. Technol. B 1071-1023 16, 2585 (1998). 10.1116/1.590242
2. S. M. Rossnagel, IBM J. Res. Dev. 0018-8646 43, 163 (1999).
3. E. H. A. Granneman, Thin Solid Films 0040-6090 228, 1 (1993). 10.1016/0040-6090(93)90552-Z (Pubitemid 23663230)
4. M. Leskela and M. Ritala, Thin Solid Films 0040-6090 409, 138 (2002). 10.1016/S0040-6090(02)00117-7 (Pubitemid 34524820)
5. R. G. Gordon, D. Hausmann, E. Kim, and J. Shepard, Chem. Vap. Deposition 0948-1907 9, 73 (2003). 10.1002/cvde.200390005
6. J. C. Rey, L. Y. Chen, J. P. McVittie, and C. Saraswat, J. Vac. Sci. Technol. A 0734-2101 9, 1083 (1991). 10.1116/1.577580
7. B. Sell, A. Sanger, G. Schulze-Icking, K. Pomplun, and W. Krautschneider, Thin Solid Films 0040-6090 443, 97 (2003). 10.1016/S0040-6090(03)00922-2
8. J. H. Yun and S. K. Park, Jpn. J. Appl. Phys., Part 1 0021-4922 34, 3216 (1995). 10.1143/JJAP.34.3216
9. R. Robertson and A. Gallagher, J. Chem. Phys. 0021-9606 85, 3623 (1986). 10.1063/1.450933
10. Y. Yang, S. Jayaraman, D. Y. Kim, G. S. Girolami, and J. R. Abelson, Chem. Mater. 0897-4756 18, 5088 (2006). 10.1021/cm0605421 (Pubitemid 44663552)
11. J. J. Hsieh, J. Vac. Sci. Technol. A 0734-2101 11, 78 (1993). 10.1116/1.578723
12. G. B. Raupp and T. S. Cale, Chem. Mater. 0897-4756 1, 207 (1989). 10.1021/cm00002a009
13. S. L. Cohen, M. Liehr, and S. Kasi, Appl. Phys. Lett. 0003-6951 60, 50 (1992). 10.1063/1.107370
14. J. E. Crowell, L. L. Tedder, H. C. Cho, and F. M. Cascarano, J. Vac. Sci. Technol. A 0734-2101 8, 1864 (1990). 10.1116/1.576817
15. S. M. Gates, Chem. Rev. (Washington, D.C.) 0009-2665 96, 1519 (1996). 10.1021/cr950233m
16. R. Robertson and A. Gallagher, J. Appl. Phys. 0021-8979 59, 3402 (1986). 10.1063/1.336806
17. A. Hasper, J. Holleman, J. Middelhoek, C. R. Kleijn, and C. J. Hoogendoorn, J. Electrochem. Soc. 0013-4651 138, 1728 (1991). 10.1149/1.2085863
18. M. H. Tsai, S. C. Sun, C. P. Lee, H. T. Chiu, C. E. Tsai, S. H. Chuang, and S. C. Wu, Thin Solid Films 0040-6090 270, 531 (1995). 10.1016/0040-6090(95) 06752-3
19. A. Intemann, H. Koerner, and F. Koch, J. Electrochem. Soc. 0013-4651 140, 3215 (1993). 10.1149/1.2221013
20. J. G. Fleming, E. Roherty-Osmun, P. M. Smith, J. S. Custer, Y. -D. Kim, T. Kacsich, M. -A. Nicolet, and C. J. Galewski, Thin Solid Films 0040-6090 320, 10 (1998). 10.1016/S0040-6090(97)01058-4
21. S. Y. No, J. H. Oh, C. B. Jeon, M. Schindler, C. S. Hwang, and H. J. Kim, J. Electrochem. Soc. 0013-4651 152, C435 (2005). 10.1149/1.1915287 (Pubitemid 41013489)
22. Y. Ohshita, A. Ogura, A. Hoshino, S. Hiiro, T. Suzuki, and H. Machida, Thin Solid Films 0040-6090 406, 215 (2002). 10.1016/S0040-6090(01)01765-5 (Pubitemid 34440508)
23. M. Ishikawa, I. Muramoto, H. Machida, S. Imai, A. Ogura, and Y. Ohshita, Thin Solid Films 0040-6090 515, 8246 (2007). 10.1016/j.tsf.2007.02.051 (Pubitemid 47239048)
24. K. Kim and K. Yong, Electrochem. Solid-State Lett. 1099-0062 6, C106 (2003). 10.1149/1.1587071
25. S. Jayaraman, Y. Yang, D. Y. Kim, G. S. Girolami, and J. R. Abelson, J. Vac. Sci. Technol. A 0734-2101 23, 1619 (2005). 10.1116/1.2049307 (Pubitemid 43119399)
26. Y. K. Chae, Y. Shimogaki, and H. Komiyama, J. Electrochem. Soc. 0013-4651 145, 4226 (1998). 10.1149/1.1838941
27. T. Sorita, S. Shiga, K. Ikuta, Y. Egashira, and H. Komiyama, J. Electrochem. Soc. 0013-4651 140, 2952 (1993). 10.1149/1.2220938
28. A. G. Zawadzki, C. J. Giunta, and R. G. Gordon, J. Phys. Chem. 0022-3654 96, 5364 (1992). 10.1021/j100192a035
29. Y. Shimogaki, T. Saito, F. Tadokoro, and H. Komiyama, J. Phys. II 1155-4312 1, 95 (1991).
30. G. H. Geiger and D. R. Poirier, Transport Phenomena in Metallurgy (Addison-Wesley, Reading, MA, 1973).
31. J. F. O'Hanlon, A User's Guide to Vacuum Technology (Wiley, New York, 1980).
32. M. Ohring, Materials Science of Thin Films: Deposition and Structure (Academic, San Diego, CA, 2002).
33. S. M. Gates and S. K. Kulkarni, Appl. Phys. Lett. 0003-6951 58, 2963 (1991). 10.1063/1.104709
34. C. J. Taylor, D. C. Gilmer, D. G. Colombo, G. D. Wilk, S. A. Campbell, J. Roberts, and W. L. Gladfelter, J. Am. Chem. Soc. 0002-7863 121, 5220 (1999). 10.1021/ja984446f (Pubitemid 29275729)
35. M. L. Hitchman and K. F. Jensen, Chemical Vapor Deposition, Principles and Applications (Academic, London, 1993).
36. R. Arora and R. Pollard, J. Electrochem. Soc. 0013-4651 138, 1523 (1991). 10.1149/1.2085820
37. N. Awaya and Y. Arita, Thin Solid Films 0040-6090 262, 12 (1995). 10.1016/0040-6090(95)05815-X
38. C. M. McConica and K. Krishnamani, J. Electrochem. Soc. 0013-4651 133, 2542 (1986). 10.1149/1.2108468
39. W. A. P. Claassen, J. Bloem, W. G. J. N. Valkenburg, and C. H. J. Van Den Brekel, J. Cryst. Growth 0022-0248 57, 259 (1982). 10.1016/0022-0248(82)90481-X
40. M. L. Hitchman, J. Kane, and A. E. Widmer, Thin Solid Films 0040-6090 59, 231 (1979). 10.1016/0040-6090(79)90296-7 (Pubitemid 10413228)
41. K. F. Jensen and D. B. Graves, J. Electrochem. Soc. 0013-4651 130, 1950 (1983). 10.1149/1.2120129
42. H. Ibach, Physics of Surfaces and Interfaces (Springer-Verlag, Berlin, 2006).
43. F. C. Tompkins, Chemisorption of Gases on Metals (Academic, London, 1978).
44. P. Vanderputte, Philips J. Res. 0165-5817 42, 608 (1987).
45. B. A. Movchan and A. V. Demchishin, Phys. Met. Metallogr. 28, 83 (1969).
46. J. A. Thornton, Annu. Rev. Mater. Sci. 0084-6600 7, 239 (1977). 10.1146/annurev.ms.07.080177.001323
47. N. Kumar, A. Yanguas-Gil, and J. R. Abelson, Appl. Phys. Lett. 0003-6951 (submitted).
48. J. R. Creighton and J. E. Parmeter, Crit. Rev. Solid State Mater. Sci. 1040-8436 18, 175 (1993). 10.1080/10408439308242560
49. J. R. Doyle, A. Nuruddin, and J. R. Abelson, J. Vac. Sci. Technol. A 0734-2101 12, 886 (1994). 10.1116/1.579273 (Pubitemid 24791645)
50. N. Kumar, A. Yanguas-Gil, S. R. Daly, G. S. Girolami, and J. R. Abelson, J. Am. Chem. Soc. 0002-7863 130, (2008).