Technical review on thermal conductivity measurement techniques for thin thermal interfaces

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2000, Pages 174-181

  Tzeng, Jim J W ^a   Weber, Tom W ^a   Krassowski, Dan W ^a  

^a UCAR Technical Centre   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EQUATIONS OF MOTION; HEAT CONDUCTION; INTERFACES (MATERIALS); MEASUREMENT ERRORS; STANDARDS; THERMAL CONDUCTIVITY OF SOLIDS;

THERMAL CONDUCTIVITY MEASUREMENT; THERMAL INTERFACES;

ELECTRONICS PACKAGING;

EID: 0033733538     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2000.837081     Document Type: Article

References (5)

1. M. N. Ozisik Heat Conduction 1980
2. Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials ASTM Test Method D5470-93
3. Evaluating the Resistance to Thermal Transmission of Thin Specimens of Materials by the Guarded Heat Flow Meter Technique ASTM Test Method E1530-93
4. Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus ASTM Test Method C518-91
5. Evaluating Thermal Conductivity of Gasket Materials ASTM Test Method F433-77