Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

Microsystem Technologies

Volumn 15, Issue 9, 2009, Pages 1467-1478

  Wunderle, Bernhard ^a   Becker, K F ^a   Sinning, R ^c   Wittler, O ^b   Schacht, R ^a   Walter, H ^a   Schneider Ramelow, M ^a   Halser, K ^a   Simper, N ^c   Michel, B ^a   Reichl, H ^b  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c HS Elektronik Systeme GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP-ON-BOARD; CRACK GROWTH; DIE-ATTACH MATERIALS; FAILURE CRITERIA; FEASIBILITY ANALYSIS; LIFETIME MODELS; LOW CYCLE FATIGUES; POWER APPLICATIONS; POWER CHIPS; PROCESS VARIABLES; REINFORCED EPOXY; SOLDER MATERIAL; TECHNOLOGY DEVELOPMENT; THERMAL ADHESIVES; THERMOMECHANICAL RELIABILITY;

BRAZING; CRACKING (CHEMICAL); RELIABILITY; SILICA; SILICONES; SILVER; TECHNOLOGICAL FORECASTING; THERMOMECHANICAL TREATMENT; WELDING;

DIES;

EID: 68949148771     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0907-1     Document Type: Article

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