Flip chip molding - High reliable flip chip encapsulation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 717-725

  Braun, T ^a   Becker, K F ^a   Koch, M ^a   Bader, V ^a   Aschenbrenner, R ^a   Reichl, H ^a  

^a Fraunhofer Institute for RM ^*  (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; EPOXY RESINS; INTEGRATED CIRCUIT MANUFACTURE; MOLDING; SIGNAL DISTORTION;

MINIATURIZATION;

FLIP CHIP DEVICES;

EID: 0036292913     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. FCIP and expanding markets for flip chip
2. Testing the dimensional Limits of high-I/O flip chip design
3. Basic design guidelines for a robust underfilling process
4. Reliability of transfer mold-underfillers flip chip devices
5. Characterization of molded underfill material for flip chip ball grid array packages
6. Reliability aspects of molded BGA's related to material properties
7. Analysis of flip chip attach reliability
8. Qualification of underfill materials for flip chip assemblies using acoustic microscopy
9. Dynamic mechanical analysis of an high-filled epoxy resin in thin layers; Poster presentation
10. Mechatronics for automotive and industrial applications