Performance and thermo-mechanical reliability of micro-channel coolers - A parametric study

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 11-16

  Wunderle, B ^a   Schacht, R ^a   Wittler, O ^b   Michel, B ^a   Reichl, H ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

High Power Flip Chip Reverse Side Cooling; Micro Channel Cooler; Parametric Study; Reliability

Indexed keywords

HIGH POWER FLIP-CHIP CIRCUITS; MICRO-CHANNEL COOLERS; PARAMETRIC STUDY; REVERSE SIDE COOLING;

CLOSED LOOP CONTROL SYSTEMS; COMPUTER CONTROL; COMPUTER SIMULATION; FLIP CHIP DEVICES; INTERFACES (MATERIALS); PARAMETER ESTIMATION; RELIABILITY; THERMAL EFFECTS;

COOLING;

EID: 4444376660     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. S.V. Garimella, Y.K. Joshi, A. Bar-Cohen, R. Mahajan, K.C. Toh, V.P. Baelmans, J. Lohan, B. Sammakia, and F. Andres. Thermal challenges in next generation electronic systems - sum-mary of panel presentations and discussions. IEEE Trans. on Components and Packaging Technologies, 25(4):569-575, 2002.
2. H. Reichl, A. Schubert, and M. Topper. Reliability of Flip-Chip and Chip Size Package. Microelectronics Reliability, (40): 1243-1254, 2000.
3. J.H. Lau and Y. Pao. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. Me Graw-Hill, 1997.
4. J.H. Lau. Thermal Stress and Strain in Microelectronic Packaging. Van Nostrand Reinhold, New York, 1993.
5. R. Hahn, A. Kamp, A. Giubikas, M. Schmidt, J. Wolf, V. Glaw, M. Topper, O. Ehrmann, and H. Reichl. High power multichip modules employing the planar embedding technique and microchannel water heat sinks. IEEE Trans. on Components, Packaging and Manufacturing Technology, 20(4):432-441, 1997.
6. R. Hahn, V. Glaw, A. Ginolas, M. Töpfer, K. Wittke, and H. Reichl. High performance liquid cooled aluminium nitride heat sinks. Microelectronics International, 16(1):21-26, 1999.
7. T. Maeder. Die Thermische Modellierung von Flip-Chip Aufbauten zur Untersuchung und Simulation von Entwärmungskonzepten. Technische Universität Dresden - Institut für Grundlagen der Elektrotechnik und Elektronik, Germany and Robert Bosch GmbH Stuttgart, Germany, 2002. Diploma thesis.
8. H. Doi, K. Kawano, A. Yasukawa, and T. Sato. Reliability of Underfill-Encapsulated Flip-Chips with Heat Spreaders. Journal of Electronic Packaging, 120:322-327, 1998.
9. B. Wunderle. Thermo-Mechanical Reliability of Flip-Chips with Heat-Spreaders. PhD thesis, Technis-che Universität Berlin, Germany, 2003. edocs.tuberlin.de/diss/2003/wunderle.bernhard.htm.
10. B. Wunderle, J. Auersperg, V. Groer, E. Kaulfersch, O. Wittler, and B. Michel. Modular parametric finite element mod-elling for reliability-studies in electronic and mems packaging. Proc. of Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, May 5-7, Cannes, France, pages 335-340, 2003.
11. P.L. Hacke, A.F. Sprecher, and H. Conrad. Thermomechanical Fatigue of 63Sn-37Pb Solder Joints, chapter 15, pages 466-499. van Nostrand Reinold, NY, USA. In: Thermol Stress and Strain in Microelectronic Packaging, edited by J.H. Lau.
12. A. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt, and B. Michel. Lead-free Flip-Chip Solder Interconnects - Materials Mechanics and Reliability Issues, pages 12-25. Micromaterials and Nanomaterials. Micro Materials Centre Berlin at the Fraunhofer Institute IZM, Germany, 1 edition, 2002.
13. R. Dudek, M. Nylen, A.Schubert, B.Michel, and H. Reichl. An Efficient Approach to Predict Solder Fatigue Life and its Appli cation to SM- and Area-Array Components. Proc. 47. Electronic Components and Technology Conference, pages 462-471, 1997.
14. A. Syed. Predicting Solder Joint Reliability for Thermal, Power & Bend Cycle within 25 % Accuracy. Proc. 51. Electronic Components and Technology Conference, pages 255-265, 2001.