Characterization of thermal interface materials

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 1367-1373

  Schacht, Ralph ^a   May, Daniel ^a   Wunderle, Bernhard ^a   Wittler, Olaf ^b   Gollhardt, Astrid ^a   Michel, Bernd ^a   Reichl, Herbert ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; INTERFACES (MATERIALS); OPTIMIZATION; SYSTEMS ANALYSIS; THERMAL CONDUCTIVITY;

SIMULATION METHODS; THERMAL INTERFACE MATERIALS;

ELECTRONIC EQUIPMENT;

EID: 42549091463     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280189     Document Type: Conference Paper

References (10)

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2. R. Viswanath, V. Wakharkar, A. Watwe and V. Lebonheur. 'Thermal Performance Requirements from Silicon to Systems', Intel Technology Journal Q3, pp. 1-16, 2000.
3. Blazej, D. 'Thermal Interface materials', Electronics Cooling, Volume 9, Number 3, August 2003, S. 14 ff
4. Bruce M. 'Calculations for thermal interface materials';, Electronics Cooling, Volume 9, Number 3, August 2003, S. 8 ff
5. Lasance, C. J.M. 'Problems with Thermal Interface Material Measurements: Suggestions for Improvement', http://www.electronics-cooling.com/html/ 2003_november_a2.html
6. Bosch, E., Lasance C. 'High accuracy thermal interface resistance measurement using a transient method' Electronics Cooling, Vol.6, No.3, September 2000
7. Netzsch TCT416, http://www.netzsch.de
8. http://www.thermagon.com/pdf/Resistance.pdf
9. Wöstmann, F.-J, Hahn, O. 'Messverfahren zur Ermittlung der Wärmeleitfähigkeit dünner Klebschichten', Produktion von Leiterplatten und Systemen, Heft 1, S. 139ff, 2005
10. May, D. 'Entwurf und Aufbau eines Messplatzes zur Charakterisierung von Thermischen Interface Materialien', Diploma Thesis, FHTW, Berlin, Germany, 2004